LSR9UG3333-W51-PF

LSR9UG3333-W51-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : 30 - Apr. - 2006 A LSR9UG3333-W51-PF BIPOLAR TYPE LED LAMPS DATA SHEET LSR9UG3333-W51-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSR9UG3333-W51-PFPART NO. 1/6Page 60° 30° 75%50%0 25% 100% -30° 25%75%50%100% -60° 8.67.6 295±5.0 15±2.0 Green Thermo-shrinking tube 1 2 5.0 5.9 9UG SR

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) LSR9UG3333-W51-PF GaAlAsRed MATERIALPART NO Emitted Lens COLOR PD Power Dissipation Tstg Storage Temperature Reverse Current @5V Operating Temperature Topr Ir Peak Forward Current Duty 1/10@10KHz Forward Current IFP IF Parameter Symbol Viewing angle 2θ1/2 (deg) 660201.52.416030020 Forward voltage @ mA(V) Peak wave length λPnm Spectral halfwidth △λnm 20 Min. Luminous intensity @20mA(mcd) Max. Min. Typ. mW100 -40 ~ +100 ℃ -40 ~ +85 μA 100 mA mA Ratings SR UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page Water Clear 9UG

2000 VESDElectrostatic Discharge( * )

Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. AlGaInP Green 574 Dominant wave length λDnm 20 1.7 2.6700110020--- --- PART NO. LSR9UG3333-W51-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 3/6PART NO. LSR9UG3333-W51-PF

Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Relative Intensity @20mA 600550500 Wavelength (nm) 0.5 Forward Voltage@20mA Normaliz @25℃ 1.0 0.8 -40-20040 2060 1.1 0.9 1.0 1.2 100 Forward Current(mA) Forward Voltage(V) 0.1 1.02.03.04.0 1.0 1000 9UG CHIP 650 Relative Intensity @20mA Normalize @25℃ Ambient Temperature(℃) 10080-400 -20 80204060100 0.5 1.0 1.5 2.0 Fig.4 Relative Intensity vs. Temperature 2.5 3.0 Page4/6 2.0 Relative Intensity Normalize @20mA Forward Current(mA) 5.0 1.0101001000 0.5 1.0 1.5 Fig.2 Relative Intensity vs. Forward Current 3.0 2.5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSR9UG3333-W51-PF

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 260°C3sec Max

60 Seconds Max

25° 00° Preheat 2°/sec max 120° 260° 100 Time(sec) 150 5°/sec max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(°C) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6PART NO. LSR9UG3333-W51-PF

This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test (10min) (10min) 2.total 10 cycles Solder Resistance Test Thermal Shock Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Description

Reliability Test: Test ItemTest Condition Reference Standard Page 6/6PART NO. LSR9UG3333-W51-PF