LSR31040-A-PF LIGITEK | Alldatasheet
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DOC. NO : QW0905- REV. : DATE : - 201325 - Jun. LSR31040/A-PF A DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS LSR31040/A-PF Pb Lead-Free Parts 發行 DCC 立碁電子
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation Package Dimensions Page 1/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LSR31040/A-PF 3.62 2.92 3.86 2.95 2.54TYP 25.0MIN 5.3 1.5MIN 0.5 1.0MIN 100%75%50% -60° -30° 0 25%50%75%100%25% 30° 60°
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only mA UNIT mW μA mA IF Parameter Symbol Absolute Maximum Ratings at Ta=25 ℃ Forward Current Ir PD Topr Power Dissipation Reverse Current @5V Operating Temperature Peak Forward Current Duty 1/10@10KHz IFP SR Ratings Typ.Min.Min. Typ. Luminous intensity @20mA(mcd) Forward voltage @10mA(V) Viewing angle 2θ 1/2 (deg)P wave length λ nm Lens MATERIAL Emitted Red COLOR Peak PART NO Typical Electrical & Optical Characteristics (Ta=25 ℃) Spectral halfwidth △λnm Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. GaAIAs LSR31040/A-PF 660201.52.1 506538 Storage Temperature Tstg -40 ~ +100 ℃ PART NO.LSR31040/A-PF Red Diffused -40~ +85
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Max. PART NO. LSR31040/A-PF SR CHIP Min. 65A10 A13 Group Luminous Intensity(mcd) at 20 mA Brightness Code For Standard LED Lamps 9065A11 A9 38 50
4/6Page PART NO. LSR31040/A-PF SR CHIP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Electro-Optical Characteristics Curve Fig.3 Forward Voltage vs. TemperatureFig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25℃ Relative Intensity@20mA Normalize @25℃ 0.8 0.0 Fig.5 Relative Intensity vs. Wavelength -40 Ambient Temperature(℃) -20020406080100 Ambient Temperature(℃) -20-40040 2080 60100 0.9 1.0 1.2 1.1 2.0 1.0 0.5 1.5 3.0 2.5 Forward Current(mA) Relative Intensity Normalize @20mA 2.0 0.1 1.0 Forward Voltage(V) 2.03.04.05.0 1.0 0.0 Forward Current(mA) 101.01001000 1.0 0.5 1.5 Fig.1 Forward current vs. Forward Voltage 1000 100 Fig.2 Relative Intensity vs. Forward Current 3.0 2.5 Relative Intensity@20mA 600 0.0 Wavelength (nm) 700650750 0.5 1.0
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 150 260°C3sec Max 260° 100 120° 500° 25°
60 Seconds Max
2°/sec max 5°/sec max Time(sec) Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Temp(°C) PART NO.LSR31040/A-PF
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference StandardDescription Page 6/6 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Test ConditionTest Item Reliability Test: Operating Life Test High Temperature Storage Test Low Temperature Storage Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Thermal Shock Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles PART NO.LSR31040/A-PF