LSR2640-S62-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : - 200607 - Dec. LSR2640/S62-PF A DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts SUPER BRIGHT ROUND TYPE LED LAMPS

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSR2640/S62-PF Page 1/5 30° 60° 50%75%25% 0 25% 100% -30° -60° 50%75%100% 25.0MIN 1.5MAX 5.9±0.3 □0.5 TYP 2.54TYP 1.0MIN 3.3 4.3 2.9 3.1 + -

3.06.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ IFP PD IF Tstg Topr Symbol Typical Electrical & Optical Characteristics (Ta=25 ℃) Power Dissipation Reverse Current @5V Storage Temperature Operating Temperature Parameter Peak Forward Current Duty 1/10@10KHz Forward Current 100 -40 ~ +100 -40 ~ +85 Ir10 Ratings SR 100 mW μA mA mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page2/5 Viewing angle 2θ 1/2 (deg) Min. Min. 1.5 Forward voltage @ mA(V) Max. 2.0 Peak wave length λPnm 660 Spectral halfwidth △λnm Typ. Luminous intensity @2mA(mcd) Emitted Red PART NO LSR2640/S62-PF MATERIAL GaAlAs Lens COLOR Red Diffused LSR2640/S62-PFPART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page3/5 LSR2640/S62-PFPART NO.

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

0 Preheat

25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5LSR2640/S62-PFPART NO.

Description

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test ConditionTest Item 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test Low Temperature Storage Test Reliability Test: Operating Life Test The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 Solderability Test High Temperature High Humidity Test Solder Resistance Test Thermal Shock Test LSR2640/S62-PFPART NO.