LSR23531-C1 LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : 23 - Sep. - 2005 LSR23531/C1 A DATA SHEET LSR23531/C1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT OVAL TYPE LED LAMPS

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. PART NO. LSR23531/C1 Page 1/4 Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 50%75%100% -60° 25%025%75%100% 50% 60° -30° 30° Vertical Axis 62° Horizontal Axis 28° + - 7.9 1.0MIN 25.0MIN 5.7 2.54TYP □0.5 TYP 1.5MAX 4.7

Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Storage Temperature Tstg COLOR LSR23531/C1 GaAlAs PART NOMATERIAL LensEmitted Red TransparentRed Soldering Temperature Tsol PART NO. LSR23531/C1 Forward Current IF Operating Temperature Reverse Current @5V Topr Ir Peak Forward Current Duty 1/10@10KHz Power Dissipation PD IFP Parameter Symbol ℃-40 ~ +100 Luminous intensity @20mA(mcd) Spectral halfwidth △λnm Peak wave length λPnm Forward voltage @ mA(V) Viewing angle 2θ1/2 (deg) Min. 6601.5 20 Typ.Max.Min. 2.490170 Max 260℃ for 5 sec Max (2mm from body) 2/4Page mA30 -40 ~ +85 μA 100 100 mW mA Ratings SR UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Vertical Axis 62° Horizontal Axis 28°

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 3/4LSR23531/C1 PART NO.

MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to see soldering well performed or not. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles Thermal Shock Test High Temperature High Humidity Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hous. Page 4/4PART NO. LSR23531/C1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Test Condition Reliability Test: Test Item Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only