LSR2040-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905-LSR2040-PF REV. : A DATE : 15 - Jun. - 2007 DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT ROUND TYPE LED LAMPS LSR2040-PF Pb Lead-Free Parts

+ - Page 1/5 3.0 4.0 4.2 5.2 1.5MAX Package Dimensions PART NO. LSR2040-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 100% 60° 30° -30° 2.54TYP 1.0MIN -60° Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 25.0MIN □0.5 TYP

Storage Temperature Tstg -40 ~ +100 ℃ Red Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) Emitted MATERIALPART NO LSR2040-PF GaAlAs Spectral halfwidth △λnm Peak wave length λPnm Viewing angle 2θ 1/2 (deg) Red Diffused Lens 66020 2.4 Max. 1.5 Min. Min. 36120 Typ. COLOR Luminous intensity @20mA(mcd) Forward voltage @20mA(V) Absolute Maximum Ratings at Ta=25 ℃ Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Parameter Page 2/5 100 SR -40 ~ +85 Ratings 100 IF Topr Ir PD IFP Symbol mA30 μA mA mW UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSR2040-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 3/5 PART NO. LSR2040-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Temp(°C) 260° 5°/sec max 260°C3sec Max 150100 Time(sec) 2°/sec max25° 00° Preheat Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 120° Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)

60 Seconds Max

PART NO. LSR2040-PF

MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test ItemTest Condition Reliability Test: High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.

Description

MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Thermal Shock Test (10min) (10min) 2.total 10 cycles Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. Page 5/5 PART NO. LSR2040-PF