LSIR3331-TBS-X-PF

LSIR3331-TBS-X-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : - 2004 DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS 19 - Nov. LSIR3331/TBS-X-PF A Pb Lead-Free Parts

25.0MIN 1.5MAX □0.5 TYP 2.54TYP 1.0MIN 7.6 8.6 5.0 5.9 FD P1 P Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LSIR3331-PF T 1/9PagePART NO. LSIR3331/TBS-X-PF ΔHP2 W0L W3W1 Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only + -

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Blue TransparentAlGaAs/GaAsLSIR3331/TBS-X-PF PART NO Device Selection Guide: LENS COLORMATERIAL Features: 1. High radiant intensity. 2. Suitable for pulsed applications. 3. Low average degradation. Descriptions: PART NO. 2/9Page The LSIR3331/TBS-X-PF series are super-high efficiency Gallium Aluminum Arsenide infrared emitting diodes encapsulated in blue transparent plastic T-1 3/4 package individually. LSIR3331/TBS-X-PF

Electrical Optical Characteristics (Aa=25) ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Symbol Ratings Parameter

2000 Electrostatic Discharge ESD

-40 ~ +85 -40 ~ +85 Topr Tstg Peak Forward Current (300PPS,10μs Pulse) Reverse Voltage Forward Current Power Dissipation Vr IF PD IFP Absolute Maximum Ratings at Ta=25 ℃ UNIT V V mA mW A Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. SIR 100 Radiant Intensity Aperture Radiant Incidence Peak Emission Wavelength Spectral Line Half Width Forward Voltage Reverse Current Viewing Angle PARAMETERSYMBOL UNITTEST CONDITION IF=20mALemW/sr EemW/cm λpeak nm △λ nm VR=5V VFV IR μA 2θ1/2 deg IF=20mA IF=20mA IF=20mA IF=20mA Min. Typ. Max. 8.0 12 1.01.7 880 1.41.7 100 PART NO. Page3/9LSIR3331/TBS-X-PF

25.51.00.96TBS-824.5 Specification Quantity/BoxPart No. LSIR3331/TBS-X-PF 2000PCS 13.0L Overall Length 330 Overall Thickness Overall Width 50H1.97 265W10.4 mm inch Symbol H L 13.4340 602.4 10.8275 W inchmm REMARK:TBS = Tape And Box Straight Leads• Dimensions Symbol Information• Adhesive Tape Width Adhesive Tape Position Feed Hole Location Tape Width Package Dimensions• 17.5 14.5 8.5 4.0 0.69 0.75 0.16 15.5 9.75 0.57 0.33 0.61 0.38 TBS-10 TBS-9 Center Of Component Location Overall Taped Package Thickness Feed Hole Pitch Lead Location Lead Length After Component Height Feed Hole To Overall Component Height 0.4311W0L T 5.1 P 12.4 4.4 1.42 7.7 0.2 0.06 0.3 5.8 130.49 0.17 0.51 0.23 18.4 19.0 0.7619.40.72 20.00.750.79 PART NO. Page 4/9 TBS-2 TBS-1 TBS-6 TBS-7 TBS-5 TBS-3 Front-To-Rear Deflection Feed Hole To Bottom Of Component 26.51.01.0425.5 19.9 24.0 22.5 0.8220.90.78 25.00.940.98 23.50.890.93 17.5 21.5 0.7318.50.69 22.50.850.89 Dimension Symbol Information• OPTION CODESYMBOL ITEMS Tape Feed Hole Diameter Minimum mm D3.8 SYMBOL inchmminch 4.20.150.17 Maximum SPECIFICATIONS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSIR3331/TBS-X-PF

Fig.3 Relative Radiant Power vs. Forward DC Current Fig.5 Forward DC Voltage vs. Temperature IFDC(mA) Forward DC Voltage @20 mA Normalize @ 25 ℃ Ambient Temperature[℃] Relative Radiant Power Normalize @20mA Fig.4 Relative Radiant Power IFPK(mA) Relative Radiant Power Normalize @100 mA Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward Current vs. Rorward Voltage Forward Current(mA) Wavelength(nm) Fig.2 Relative Radiant Intensity vs. Wavelength Relative Radiant Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SIR CHIP 0.1 100 1000 0.0 750 0.11 0.1 -40 0.8 -40 0.0 0.5 1.0 80085090095010001050 Relative Radiant Power Normalize @ 20mA,25℃ Ambient Temperature[℃] Fig.6 Relative Radiant Power vs. Temperature vs. Forward Peak Current 1.0 10.0 10100 1001000 1.0 10.0 0.9 1.0 1.1 1.2 -20020406080100-20040 2060100 80 0.5 1.0 1.5 2.0 2.5 3.0 PART NO. Page5/9LSIR3331/TBS-X-PF

Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Storage time: 1.The operation of Temperatures and RH are : 5℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5℃ ~ 35℃,RH<60%, they should be treated at 60℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Circuit model A PART NO. Circuit model B LED LED LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/9LSIR3331/TBS-X-PF

Anode side(cathode side on GaAlAs chips) 2. The LED lamps are designed for high-density mount- ing and have a structure which can alleviate mechan- ical stress due to clinching . Nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . 45°15° LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Mounting: 1. If the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. For this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead. (O) (O) PART NO. (X) Page 7/9LSIR3331/TBS-X-PF

60 Seconds Max

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 00° 25° 120° Preheat 2°/sec max Temp(°C) 260° 2.Wave Soldering Profile PART NO. Time(sec) 100 260°C3sec Max 5°/sec max 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/9LSIR3331/TBS-X-PF

This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test Solder Resistance Test This test intended to see soldering well performed or not. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 High Temperature High Humidity Test Thermal Shock Test High Temperature Storage Test Low Temperature Storage Test Operating Life Test Reliability Test: Test Item PART NO. Reference Standard The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.

Description

This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. (10min) (10min) 2.total 10 cycles 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=85 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 9/9PageLSIR3331/TBS-X-PF