LSIR13731 LIGITEK | Alldatasheet

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zL, LIGITEK ELECTRONICS CO.,LTD. LIGITEK Property of Ligitek Only TEL:(02)22677686(REP) FAX:(02)22675286,(02)22695616 INFRARED EMITTING DIODES LSIR13731 DOC.NO : QW0905-LSIR13731 REV. : A DATE : 16-Jul-2004

[a LIGITEK ELECTRONICS CO.,LTD. LIGITEK Property of Ligitek Only PART NO. LSIR13731 Page 1/4 Package Dimensions 5.0 *? 7 se LL | 1.5MAX 25.0MIN 00.5 |) TYP | 4.0MIN-+ 2.54TYP Note : 1.All dimension are in millimeter tolerance is +0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Features: 1. High radiant intensity. 2. Suitable for pulsed applications. 3. Low average degradation. Descriptions: The LSIR13731 series are super-high efficiency Gallium Aluminum Arsenide infrared emitting diodes encapsulated in blue transparent plastic T-1 3/4 package individually Device Selection Guide:

[ie LIGITEK ELECTRONICS CO.,LTD. i LIGITEK Property of Ligitek Only PART NO. LSIR13731 Page 2/4 Absolute Maximum Ratings at Ta=25°C Parameter Symbol UNIT or Daspin Pm Peak Forward Current IrP 3 A 300PPS,1 «zs Pulse Electrostatic Discharge 2000 Operating Temperature -55 ~ +100 Storage Temperature -55 ~ +100 F Max 260°C for 5 sec Max Soldering Temperature (2mm from body) Electrical Optical Characteristics (Aa=25°C ) ee omnis | m7 |) | amen | mn Se ‘sensi an) | Om | mn remem wv |e Ce [vewmawe ao] fs || ow || Note : 1.The forward voltage data did not including +0.1V testing tolerance. 2. The radiant intensity data did not including +15% testing tolerance.

(he LIGITEK ELECTRONICS CO.,LTD. Le, LIGITEK Property of Ligitek Only PART NO. LSIR13731 Page3/4 Typical Electro-Optical Characteristics Curve SIR CHIP Fig.1 Forward Current vs. Rorward Voltage Fig.2 Relative Radiant Intensity vs. Wavelength 1000 > 1.0 q E 100 are 2 E 5 40 S905 1S) > oO mare

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u ot 3” 00 r _ 05 1.0 15 20 25 750 800 850 900 950 1000 1050 Forward Voltage(V) Wavelength(nm) Fig.3 Relative Radiant Power Fig.4 Relative Radiant Power vs. Forward DC Current vs. Forward Peak Current 10.0 10.0 & & Z< sc && as < “Sd So 1, nod a gs 7 Bg Ea ge 25 BE 8 3 So & “= 0.4 0.1 1 10 100 10 100 1000 Iroc(mA) lrx(MA) Fig.5 Forward DC Voltage vs. Temperature Fig.6 Relative Radiant Power vs. Temperature < 1.2 3.0 @? 14 aa” ire} az 90 lO ef fc) g8 2© 10 $V 15 Sa E® os og '° aE 09 23 oS we 0.5 4 SE & 26 = 0.8 «Zz 00 ge -40 -20 0 20 40 60 80 100 40 -20 0 20 40 60 80 100 Ambient Temperature[‘C ] Ambient Temperature[‘’C]

[a LIGITEK ELECTRONICS CO.,LTD. LIGITEK Property of Ligitek Only PART NO. LSIR13731 Page 4/4 Reliability Test: Test Item Test Condition Description Reference Standard 1.Under Room Temperature This test is conducted for the purpose | MIL-STD-750: 1026 Operating Life Test 2.1f=20mA of detemining the resisance of a part MIL-STD-883: 1005 3.t=1000 hrs (-24hrs, +72hrs) in electrical and themal stressed. JIS C7021: B-1 The purpose of this is the resistance of High Temperature 1.Ta=105'C 45°C the device which is laid under ondition MIL-STD-883:1008 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) —_| of hogh temperature for hours. JIS C 7021: B-10 The purpose of this is the resistance Low Temperature 1.Ta=-40'C45°C of the device which is laid under JIS © 7024: B12 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) __| condition of low temperature for hours. : High Temperature 1Ta-65 C45 C The purpose of this test is the resistance | MIL-STD-202:103B High Humidity Test auaried eda of the device under tropical for hous. JIS C 7021: B-11 1.Ta=108'C 45°C 8-40'C45°C The purpose of this is the resistance of | MIL-STD-202: 107D Thermal Shock Test (10min) (10min) the device to sudden extreme changes. | MIL-STD-750: 1051 2.total 10 cycles in high and low temperature. MIL-STD-883: 1011 This test intended to determine the , pany thermal characteristic resistance MIL-STD-202: 210A Solder Resistance 1T-Sol=260'C 25C of the device to sudden exposures MIL-STD-750: 2031 esi 2.Dwell time= 1041sec. at extreme changes in temperature JIS C 7021: At when soldering the lead wire. MIL-STD-202; 208D or 1.T.Sol=230°C45'C This test intended to see soldering well | MIL-STD-750: 2026 Solderability Test 2.Dwell time=5!1sec performed or not. MIL-STD-883: 2003 JIS C 7021: A-2