LSGM3330-S46 LIGITEK | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
DOC. NO : QW0905- REV. : DATE : DATA SHEET LSGM3330/S46 ROUND TYPE LED LAMPS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only - 200604 - Mar. A LSGM3330/S46 Pb Lead-Free Parts
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only + - 25.0MIN □0.5 TYP 2.54TYP 1.0MIN LSGM3330/S46PART NO.1/5 Page 7.6 8.6 1.5 MAX 5.0 5.9 100%75%50% -60° -30° 25%025%100% 75%50% 60° 30°
@20mA(V) Typ. Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. COLOR Green Diffused InGaN/SiC MATERIAL LSGM3330/S46 PART NO Green Emitted Spectral halfwidth △λnm wave length λ nm 518 Lens wave length λ nm 525 353.5 Electrostatic Discharge( * ) Storage Temperature Operating Temperature Power Dissipation Forward Current Peak Forward Current Duty 1/10@10KHz Reverse Current @5V 1000ESD Tstg Topr -30 ~ +100 -20 ~ +80 PD Ir IFP IF 100 Luminous intensity @ mA(mcd) Viewing angle 2θ 1/2 (deg) 4504.2 700 Min.Max. Typ. V mW μA mA mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol Ratings UNIT 100 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. P D DominantPeak 2/5PageLSGM3330/S46PART NO.
Fig.3 Forward Current vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Current@20mA Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Fig.2 Forward Current vs. Relative Intensity LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 010 0.0 0.5 1.0 1.5 2.0 2.5 0204060 500550 0.0 0.5 1.0 2.03.04.0 80100 402060 2.0 0.0 0.5 1.0 1.5 SGM CHIP 3.52.51.5 Relative Intensity Normalize @20mA Forward Current(mA) 20304050 305070 450600 LSGM3330/S46PART NO.
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5
0 Preheat
25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max
60 Seconds Max
LSGM3330/S46PART NO.
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Test ConditionTest Item Reliability Test: 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Operating Life Test Low Temperature Storage Test High Temperature Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles High Temperature High Humidity Test Thermal Shock Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to see soldering well performed or not. Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 LSGM3330/S46PART NO.