LSGL2043

LSGL2043 LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : DATA SHEET ROUND TYPE LED LAMPS LSGL2043 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSGL2043 17 - Dec. - 2005 A

60° 30° 100%25%0 75%50% -30° -60° 100%75%50%25% Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSGL2043 Page 1/5 + - 25.0MIN □0.5 TYP 1.0MIN 2.54TYP 1.5MAX 5.24.2 4.03.0

Duty 1/10@10KHz Reverse Current @5V Storage Temperature PART NO Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LSGL2043 Operating Temperature InGaN/SiC MATERIAL 550900 Luminous intensity @20mA(mcd) Min. Typ. Viewing angle 2θ 1/2 (deg) -30 ~ +100 -20 ~ +80 Tstg Topr PD Ir IFP mA mW μA 100 120 Absolute Maximum Ratings at Ta=25 ℃ PART NO. Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter Symbol UNIT Page SGL

500 VESD Electrostatic Discharge( * )

Water Clear 502 30 3.5 4.2 Peak wave length λPnm Lens COLOR Forward voltage @20mA(V) Spectral halfwidth △λnm Typ. Max.Emitted Green Dominant wave length λDnm 505 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LSGL2043

0.2 0.4 0.8 55504535 Ambient Temperature Ta(℃) Relative Luminous Intensity(a.u.) 25201553.52.5 3/5Page SGL CHIP PART NO. 1.5 1.0 0.5 0.0 2.0 60 70654025 30 10080 4.03.02.0 1.0 0.6 0.0 600550 6040200 1.5 1.0 0.5 0.0 100 1.5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Relative Intensity Normalize @20mA Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Forward Current(mA) Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Typical Electro-Optical Characteristics Curve Fig.4 Relative Intensity vs. Ambient Temp Forward Current(mA) Wavelength (nm) Relative Intensity@20mA Ambient Temperature Ta(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Ambient Temp LSGL2043

60 Seconds Max

0 Preheat

25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Page 4/5LSGL2043

This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hous. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec High Temperature High Humidity Test Thermal Shock Test Solder Resistance Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202:103B JIS C 7021: B-11 This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Low Temperature Storage Test The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Test ItemTest Condition Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5/5PagePART NO.LSGL2043