LSG3330 LIGITEK | Alldatasheet
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&, LIGITEK ELECTRONICS CO.,LTD. LIGITEK Property of Ligitek Only TEL:(02)22677686(REP) FAX:(02)22675286,(02)22695616 ROUND TYPE LED LAMPS LSG3330 DOC.NO : QW0905-LSG3330 REV. : A DATE : 23-Sep-2004
fo. LIGITEK ELECTRONICS CO.,LTD. LIGITEK Property of Ligitek Only Package Dimensions 5.0 5.9 76 i. 1 5MAx_! | 25.0MIN 0 0.5 TYP | 1omin— 2.54TYP Note : 1.All dimension are in millimeter tolerance is +0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 100% 75% 50% 25% O 25% 50% 75% 100%
[he LIGITEK ELECTRONICS CO.,LTD. LIGITEK Property of Ligitek Only PART NO. LSG3330 Page 2/4 Absolute Maximum Ratings at Ta=25°C Peak Forward Current Operating Temperature -40 ~ +85 Storage Temperature -40 ~ +100 . Max 260°C for 5 sec Max Soldering Temperature (2mm from body) Typical Electrical & Optical Characteristics (Ta=25°C ) Peak | Spectral | Forward Luminous | Viewing COLOR wave |halfwidth| voltage intensity angle PART NO | MATERIAL length | A A nm @20mA(V) | @10mA(med) | 26 1/2 APnm (deg) Note : 1.The forward voltage data did not including +0.1V testing tolerance. 2. The luminous intensity data did not including +15% testing tolerance.
ks LIGITEK ELECTRONICS CO.,LTD. Le, LIGITEK Property of Ligitek Only PART NO. LSG3330 Page3/4 Typical Electro-Optical Characteristics Curve SG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.5 S 10 A Td eg 1s i ae 5 25 op 4 | | * on ara y Ss Smee of GOTT EO Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 12 3.0 z | eee OR " Ox 2.0 Fe | | hv] hd] dT | $5 28. ortt | fl any) s- of ttt 40-20 0 20 40 60 80 100 40 -20 0 20 40 60 80 100 Ambient Temperature(‘C ) Ambient Temperature(‘C ) Fig.5 Relative Intensity vs. Wavelength < 1.0 q Py 2 0.5 e Boo 550 600 650 Wavelength (nm)
L LIGITEK ELECTRONICS CO.,LTD. ( LIGITEK Property of Ligitek Only PART NO. LSG3330 Page 4/4 Reliability Test: Test Item Test Condition Description Reference est Iter Standard 1.Under Room Temperature This test is conducted for the purpose MIL-STD-750: 1026 Operating Life Test 2.If=20mA of detemining the resisance of a part MIL-STD-883: 1005 3.t=1000 hrs (-24hrs, +72hrs) in electrical and themal stressed. JIS C7021: B-1 The purpose of this is the resistance of High Temperature 1.Ta=105C45°C the device which is laid under ondition MIL-STD-883:1008 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) of hogh temperature for hours. JIS C 7021: B-10 The purpose of this is the resistance Low Temperature 1.Ta=-40°C 15°C of the device which is laid under JIS C7021: B12 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) condition of low temperature for hours. a High Temperature 1.Ta=65 C45 C The purpose of this test is the resistance | _ MIL-STD-202:103B High Humidity Test vied iatera % of the device under tropical for hous. JIS C 7021: B11 41.Ta=105°C 45°C &-40°C 45°C The purpose of this is the resistance of MIL-STD-202: 107D Thermal Shock Test (10min) (10min) the device to sudden extreme changes | MIL-STD-750: 1051 2.total 10 cycles in high and low temperature. MIL-STD-883: 1011 This test intended to determine the os thermal characteristic resistance MIL-STD-202: 210A Solder Resistance 1-T.Sol=260C35'C of the device to sudden exposures MIL-STD-750: 2031 Test 2.Dwell time= 10+1sec. at extreme changes in temperature JIS C7021: A-1 when soldering the lead wire. MIL-STD-202: 208D F 1.T.Sol=230°C45°C This test intended to see soldering well_| MIL-STD-750: 2026 Solderability Test 2 Dwell time=5t1sec performed or not. MIL-STD-883: 2003 JIS C 7021: A-2