LSG13530-PF LIGITEK | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

DATE : 08- Jul. - 2010 DOC. NO : QW0905-LSG13530-PF REV. : A DATA SHEET ROUND TYPE LED LAMPS LSG13530-PF Pb Lead-Free Parts LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 發行 DCC 立碁電子

25.0MIN □0.5 TYP 75% Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. -60° 100% 60° 30°-30° + - 1.0MIN 2.54TYP PART NO. LSG13530-PF Package Dimensions Page 1/5 8.6 1.5MAX 5.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Absolute Maximum Ratings at Ta=25 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) mA120IFP Peak Forward Current Duty 1/10@10KHz Max. Forward voltage @ mA(V)COLOR Green Diffused Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Emitted LSG13530-PFGaP Green MATERIALPART NO Min.Lens 560301.72.6 Peak wave length λPnm Spectral halfwidth △λnm 20 Reverse Current @5V Power Dissipation Operating Temperature Storage Temperature Tstg Topr PD Ir -40 ~ +85 -40 ~ +100 100 Min. Typ. 301236 Viewing angle 2θ 1/2 (deg) Luminous intensity @10mA(mcd) mW μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Symbol Forward Current Parameter IF SG Ratings UNIT mA Page 2/5 PART NO. LSG13530-PF

Relative Intensity@20mA Wavelength (nm) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 SG CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3/5Page 3.5 0.5 0.0 500 1.0 550 600 650

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 5°/sec max Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

0 Preheat 50

25° 120° 2°/sec max Time(sec) 100 150 Temp(°C) 260° 260°C3sec Max PART NO. LSG13530-PF Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test Thermal Shock Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.

Description

PART NO. LSG13530-PF Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Reliability Test: Test ConditionTest Item Page 5/5 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard