LSEG85292-S1-PF

LSEG85292-S1-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET DOC. NO : QW0905-LSEG85292/S1-PF-0808 REV. : A DATE : 14 - Aug. - 2007 LSEG85292/S1-PF

7.0 2.0 1.95 28.0±0.5 1.27TYP 12 3 1.27TYP - + - 口0.5 TYP - + - 1 2 G SE 3.30 27.0±0.5 1/6PagePART NO. LSEG85292/S1-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions 30° 75%100%25%25%050% 60° Directivity Radiation 75%100% -60° Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 50% -30°

45 1.8 1.81.2 1.2 --- 2.6 2/6Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT GreenOrange SymbolParameter Ratings Absolute Maximum Ratings at Ta=25 ℃ mA mW 8080 5040 μA10 IFP PD Power Dissipation Peak Forward Current Duty 1/10@10KHz Ir Reverse Current @5V Forward Current IF mA1515 ℃-40 ~ +100Tstg Storage Temperature Forward voltage @20mA(V) Spectral halfwidth △λnm Luminous intensity @ mA(mcd)COLOR PART NO MATERIAL Typical Electrical & Optical Characteristics (Ta=25 ℃) Typ. Max.Min.Min.LensEmitted Orange White Diffused LSEG85292/S1-PF GaAsP/GaP GaP Green Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Peak wave length λPnm Viewing angle 2θ 1/2 (deg) Operating Temperature -40 ~ +85Topr ℃ 1.7 1.7 Typ. --- 2.1 Forward voltage @10mA(V) 50 LSEG85292/S1-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature 1.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 750700650600550 Wavelength (nm) 0.5 Relative Intensity@20mA 0.0 1.0 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength -20 0.8 -4020 0 0.9 806040100 0.0 -40-20 020 0.5 Relative Intensity Normalize @20mA Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.0 1.1 2.0 1.5 2.5 3.0 1.0 1.03.0 2.0 0.1 100 1.0 4.05.0 0.0 1.010 0.5 1.5 2.5 2.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 1000 SE CHIP 3.0 1006080 1000100 Page3/6LSEG85292/S1-PFPART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 500550600650 0.0 0.5 1.0 G CHIP LSEG85292/S1-PFPART NO.

60 Seconds Max

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 5°/sec max 260°C3sec Max Temp(°C) 260° 150100 Time(sec) 2°/sec max25° 00° Preheat Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 120° Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) LSEG85292/S1-PFPART NO.

MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test Item Operating Life Test Test Condition Reliability Test: High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.

Description

MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202:103B JIS C 7021: B-11 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. LSEG85292/S1-PFPART NO.