LSEG55162/L8

LSEG55162-L8 LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSEG55162/L8 RECTANGLE TYPE LED LAMPS DATA SHEET DOC. NO : QW0905- REV. : A DATE : - 200513 - Sep. LSEG55162/L8

100%75%50% -60° -30° 100%25%025%75% 50% 60° 30° LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LSEG55162/L8PART NO. Page 1/5 1 2 65.0MIN 2.54TYP 1.0MIN 1.5MAX 0.5TYP 4.0 2.0 3.0

4.0 Luminous intensity @10mA(mcd) Typ. Spectral halfwidth △λnm 610 Peak wave length λPnm Max. Forward voltage @ mA(V) Min. 1.8 Min. Viewing angle 2θ1/2 (deg) 152 Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mA μA mW SE Ratings 10Ir -40 ~ +85 Max 260℃ for 5 sec Max (2mm from body) -40 ~ +100 Forward Current Peak Forward Current Duty 1/10@10KHz Parameter Operating Temperature Soldering Temperature Storage Temperature Reverse Current @5V Power Dissipation Typical Electrical & Optical Characteristics (Ta=25 ℃) Symbol Tsol Topr Tstg IF PD IFP Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LSEG55162/L8 305653.07.0152 100 120 G Green Orange GaP GaAsP/GaP 1.7 White Diffused 2.6 1.7 2.6 PART NO. LSEG55162/L8 2/5

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature 1.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 750700650600550 Wavelength (nm) 0.5 Relative Intensity@20mA 0.0 1.0 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength -20 0.8 -4020 0 0.9 806040100 0.0 -40-20 020 0.5 Relative Intensity Normalize @20mA Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.0 1.1 2.0 1.5 2.5 3.0 1.0 1.03.0 2.0 0.1 100 1.0 4.05.0 0.0 1.010 0.5 1.5 2.5 2.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 1000 SE CHIP 3.0 1006080 1000100 PART NO. Page3/5LSEG55162/L8

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP PART NO. 4/5 PageLSEG55162/L8

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest ConditionTest Item Reliability Test: 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. High Temperature Storage Test Low Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. High Temperature High Humidity Test Thermal Shock Test Solder Resistance Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not.Solderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. LSEG55162/L8PART NO. 5/5Page