LSEG21463-PF

LSEG21463-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 19 - May. - 2006 A LSEG21463-PF Lead-Free Parts Pb

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation PART NO. LSEG21463-PF 1/6Page -60° 100%100% 30° 60° 50%75%25% 0 25% -30° 50%75% SE G 1 2 □0.5 TYP 25.0MIN 1.0MIN 2.54TYP 2.0 2.5 5.4 1.5 MAX 2.0 2.0

45 4.0 6.03.0 1.8 2.6 2.6 1.7 1.7 2/6Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT GSE SymbolParameter Ratings Absolute Maximum Ratings at Ta=25 ℃ mA mW 12080 10080 μA10 IFP PD Power Dissipation Peak Forward Current Duty 1/10@10KHz Ir Reverse Current @5V Forward Current IF mA3020 ℃-40 ~ +100Tstg Storage Temperature Forward voltage @20mA(V) Spectral halfwidth △λnm Luminous intensity @ mA(mcd)COLOR PART NOMATERIAL Typical Electrical & Optical Characteristics (Ta=25 ℃) Typ. Max.Min.Min.LensEmitted Orange Water Clear LSEG21463-PF GaAsP/GaP GaP Green Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Peak wave length λPnm Viewing angle 2θ 1/2 (deg) Operating Temperature -40 ~ +85Topr ℃ LSEG21463-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature 1.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 750700650600550 Wavelength (nm) 0.5 Relative Intensity@20mA 0.0 1.0 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength -20 0.8 -4020 0 0.9 806040100 0.0 -40-20 020 0.5 Relative Intensity Normalize @20mA Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.0 1.1 2.0 1.5 2.5 3.0 1.0 1.03.0 2.0 0.1 100 1.0 4.05.0 0.0 1.010 0.5 1.5 2.5 2.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 1000 SE CHIP 3.0 1006080 1000100 Page3/6LSEG21463-PFPART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP 4/6PageLSEG21463-PFPART NO.

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Time(sec) 120° Preheat0 25° 0° 50 100 2°/sec max 260° Temp(°C) 260°C3sec Max 5°/sec max 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Page 5/6

60 Seconds Max

LSEG21463-PFPART NO.

This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to see soldering well performed or not. (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Thermal Shock Test Solder Resistance Test High Temperature High Humidity Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202:103B JIS C 7021: B-11 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Test Item Reliability Test: Test Condition Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 6/6PageLSEG21463-PFPART NO.