LSEFSBKS2093

LSEFSBKS2093 LIGITEK | Alldatasheet

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DOC. NO : QW0905-LSEFSBKS2093 REV. : A DATE : 28 - Jul. - 2006 DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DURL COLOR LED LAMPS Pb Lead-Free Parts

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.ANODE BLUE 2.COMMON CATHODE 3.ANODE ORANGE SEF 1.5 MAX 6.7±0.55.2 Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.54TYP 2.0MIN 18.0MIN 2.54TYP 2.0MIN □0.5 TYP 1 2 3 1 32 SBKS Package Dimensions PART NO. 3.0 4.2 4.0 LSEFSBKS2093 Page 1/6

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) Topr Tstg COLOR Lens Water Clear MATERIALPART NO AlGaInP LSEFSBKS2093 Orange Emitted Operating Temperature Storage Temperature Viewing angle 2θ 1/2 (deg) Dominant wave length λDnm Spectral halfwidth △λnm Forward voltage @20mA(V) Luminous intensity @20mA(mcd) Max. 605 Min. 17 1.7 2.61800 Typ. 900 Min. -20 ~ +80 -30 ~ +100 ℃ Absolute Maximum Ratings at Ta=25 ℃ Symbol ESD Forward Current Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Electrostatic Discharge( * ) Power Dissipation Parameter Page 2/6 PD Ir IFP IF 120 2000 SEF Ratings mW μA V mA mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SBKS 100 120 500 InGaN/SiC Blue 475 26 4.216035030 Typ. 3.5 ---- ---- Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. PART NO. LSEFSBKS2093

Relative Intensity@20mA 550 0.0 0.5 Wavelength (nm) 600650500 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 SEF CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page3/6PART NO. LSEFSBKS2093

Ambient Temperature(℃) Fig.3 Forward Current vs. Temperature Forward Current@20mA 680 630 530 430 480 480 380 580 Relative Intensity@20mA 1005075 Wavelength (nm) Fig.4 Relative Intensity vs. Wavelength 0.5 1.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve Forward Current(mA) SBK-S CHIP 1.0 Relative Intensity Normalize @20mA Forward Current(mA) 543 05 Forward Voltage(V) 0.25 0.75 0.5 3025151020 Fig.2 Relative Intensity vs. Forward Current 1.5 1.25 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page4/6PART NO. LSEFSBKS2093

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 260°C3sec Max 5°/sec max 260° 120° Temp(°C) Time(sec) 15050 100 2°/sec max25° Preheat0

60 Seconds Max

PART NO. LSEFSBKS2093

MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 (10min) (10min) 2.total 10 cycles Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Thermal Shock Test High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 Reliability Test: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Test Condition 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Low Temperature Storage Test Operating Life Test Test Item This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.

Description

MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 Reference Standard PART NO. LSEFSBKS2093