LSEF42240-PF-TRF-X

LSEF42240-PF-TRF-X LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND REEL TYPE LED LAMPS LSEF42240-PF/TRF-X - 2013 30 -Jan. LSEF42240-PF/TRF-X A Pb Lead-Free Parts 發行 DCC 立碁電子

P FD Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 25.0MIN 1.0MIN 2.54TYP + - □0.5 TYP LSEF42240-PF 4.0 5.24.2

1.5 MAX

3.0 T PART NO. LSEF42240-PF/TRF-X ΔH L H P1 +- W1 W3 Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8

Typ.Min.Max.Min.Emitted Lens Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Orange DiffusedLSEF42240-PF/TRF-X AlGaInPOrange60517450 1.72.6 90050 Typical Electrical & Optical Characteristics (Ta=25 ℃) MATERIALPART NO Storage Temperature Operating Temperature Viewing angle 2θ1/2 (deg) COLOR Dominant wave length λDnm Spectral halfwidth △λnm Luminous intensity @20mA(mcd) Forward voltage @20mA(V) -40 ~ +100 -40 ~ +85 Tstg Topr Absolute Maximum Ratings at Ta=25 ℃ Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Forward Current Peak Forward Current Duty 1/10@10KHz Parameter mW65PD 2000ESD Ir V μA IFP IF mA mA Ratings SEF Symbol UNIT Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSEF42240-PF/TRF-X

Brightness Code For Standard LED Lamps Min. Max. Luminous Intensity(mcd) at 20 mA Group LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Color Code Wave length(nm) at 20 mA Max. 603 Min. 60021 Group A20 700 900 23 606609 A21900 1100 PART NO. LSEF42240-PF/TRF-X A22 1100 1500 A23 1500 1800

TRF-7 0.6717.12521.1250.83 Package Dimensions• Dimensions Symbol Information• Core Diameter Hub Recess Inside Diameter Arbor Hole Diameter Reel Diameter Iside Reel Flange Thickness Overall Reel Thickness LSEF42240-PF/TRF-X 1.18 2000PCS 30.050.01.97 maxmum T 0.54 --- 13.8 ---57.2 38.1 1.37 1.1328.6 34.9 88.0 102 D SymbolDescription inch 3.0878.2 mm 380 mm minimum Specification 2.25 1.5 3.46 4.02 MARKING 14.96 inch Feed Hole Pitch Lead Length After Component Height Feed Hole To Overall Component Height Overall Taped Package Thickness Feed Hole Location Center Of Component Location Tape Width Adhesive Tape Position Adhesive Tape Width REMARK:TRF=Tape And Reel Forming Leads 0.610.5715.514.5 0.6917.5 0.7519.0 0.164.0 8.5 0.33 5.10.2 0.061.42 0.389.75 0.37.7 TRF-12 TRF-9 TRF-11 TRF-8 0.8323.00.9121.0 12.40.49 0.4311.0 0.5113.0 1.4236 1.0226.0 24.00.94 20.00.79 1.128.0 1.0226.0 0.8922.5 Page 4/8 Component Lead Pitch Tape Feed Hole Diameter Dimensions Symbol Information• Height Of Seating Plane Feed Hole To Bottom Of Component H TRF-3 TRF-5 TRF-6 TRF-4 TRF-1 TRF-2 0.8924.50.9622.5 0.8521.5 20.20.8 25.51.0 0.8922.5 0.8321.2 1.0426.5 0.6917.5 19.00.75 15.5 0.61 0.7719.5 0.8321.0 0.6516.5 SYMBOL D OPTION CODE SYMBOL ITEMS MaximumMinimum 0.153.8 4.80.19 mminch 0.174.2 0.235.8 inchmm SPECIFICATIONS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only D T2T1 D2 D1 PART NO. LSEF42240-PF/TRF-X

0.184.553.15P10.12Lead Location Iside Reel Flange Thickness LSEF42240-PF/TRF-X T150.0 2000PCS 30.01.181.97 Symbol REMARK:TRF=Tape And Reel Forming Leads Dimensions Symbol Information• DReel Diameter Arbor Hole Diameter Hub Recess Inside Diameter Core Diameter

Description

Center Of Component Location Feed Hole Location Overall Taped Package Thickness Package Dimensions• MARKING 14.963803.0878.2 102 88.0 38.1 1.1328.6 13.80.54 34.91.37 3.46 1.5 4.02 mm Specification minimum mm inch maxmum inch W317.5 14.5 T 8.5 P25.1 15.5 19.00.69 0.57 04.0 0.75 0.16 0.61 9.75 1.42 0.33 0.27.7 0.38 0.06 0.3 Feed Hole To Bottom Of Component Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Height Of Seating Plane 1.0827.525.51.0TRF-19 L P12.4 TRF-21 TRF-22 TRF-20 25.0 20.5 13.0 11.0W0 0.49 0.43 0.51 1.42 22.5 27.00.98 0.81 1.06 0.89 TRF-15 TRF-17 TRF-18 TRF-16 TRF-13 TRF-14 Dimensions Symbol Information• Tape Feed Hole Diameter Component Lead Pitch SYMBOL ITEMS MinimumOPTION CODE 3.8D F 4.8 mm SYMBOL mm 4.20.15 0.195.8 inch 0.17 0.23 inch Maximum SPECIFICATIONS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/8 19.0 0.75 20.0 0.79 21.7 0.85 23.7 0.93 22.50.89 23.50.93 17.5 0.69 18.0 0.71 18.5 0.73 19.5 0.77 20.5 0.8121.5 0.85 22.00.8723.00.91 D T1 T2 D1D2 PART NO. LSEF42240-PF/TRF-X TRF-23 27.51.0828.5 1.12

02.5 1.50.5 650600550 0.5 0.0 500 Wavelength (nm) Relative Intensity@20mA 1.0 SEF CHIP Typical Electro-Optical Characteristics Curve Page 6/8 2.5 1.5 1.0 0.5 0.0 2.0 608002040-20 0.9 0.8 3.02.0 1.2 1.1 1.0 6040200-20 3.0 2.0 1.0 0.0 1000100101.0 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Relative Intensity Normalize @20mA Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Forward Current(mA) Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Relative Intensity@20mA Normalize @25℃ Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature PART NO. LSEF42240-PF/TRF-X 30°-30° 60° -60° 100% 75% 6.Directivity Radiation

PART NO. LUY9653R-30B/H7-AM

60 Seconds Max

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Page7/8 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Time(sec) 150 260°C3sec Max 100 5°/sec max 50Preheat 2°/sec max 260° 120° 0° 0 25° Temp(°C)

This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to see soldering well performed or not. 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Test Item Reliability Test: Test Condition Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/8 PART NO. LSEF42240-PF/TRF-X