LSEDBK3342-L1

LSEDBK3342-L1 LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb DOC. NO : QW0905- REV. : DATE : LSEDBK3342/L1 06 - Sep. - 2008 A

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions SE DBK LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSEDBK3342/L1PART NO. 1/6Page Directivity Radiation 75%100% 50% 025% -60° -30° 25% 75%50% 100% 60° 30° 1 2 1 2 5.95.0 □0.5 TYP 25.0MIN 1.0MIN 2.54TYP 7.6 1.5MAX 8.6

-20 ~ +80 ℃ Operating Temperature Topr 1.72.6120 9.021Orange InGaN/GaN Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Dominant wave length λDnm PART NO MATERIAL COLOR LSEDBK3342/L1 GaAsP/GaP White Diffused Emitted Lens Forward voltage @20mA(V) Luminous intensity @20mA(mcd) Spectral halfwidth △λnm Viewing angle 2θ 1/2 (deg) 3.54.0160120 300 Typical Electrical & Optical Characteristics (Ta=25 ℃) Storage Temperature Tstg -30 ~ +100 ℃ DBKSE Power Dissipation PD Electrostatic Discharge( * ) Reverse Current @5V ESD Ir Peak Forward Current Duty 1/10@10KHz Forward Current IFP IF 120 mW 1502000 V 50 μA 100 mA 30 mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol UNIT Page 2/6 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Blue ---- ---- PART NO. LSEDBK3342/L1 Peak wave length λPnm 610 ---- 45 ---- 470 20

3.0 2.5 1.5 1.0 0.5 0.0 2.0 60100 8002040-40-20 0.9 0.8 10080 5.04.03.02.0 1.0 0.5 0.0 600550 1.2 1.1 1.0 6040200-20-40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1000100101.0 1000 100 1.0 0.1 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Relative Intensity Normalize @20mA Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Forward Current(mA) Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Typical Electro-Optical Characteristics Curve Relative Intensity@20mA Normalize @25℃ Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25℃ Wavelength (nm) Relative Intensity@20mA Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature PART NO. LSEDBK3342/L1

3.0 2.5 Fig.1 Forward current vs. Forward VoltageFig.2 Relative Intensity vs. Forward Current 1000100 2.0 1.5 1.0 0.5 0.0 1015.02.0 Forward Voltage(V) Forward Current(mA) Forward Current(mA) Relative Intensity Normalize @20mA 3.01.2 Fig.3 Forward Voltage vs. Temperature 2.0 1.0 1.5 1.1 0.9 1.0 2.5 Fig.4 Relative Intensity vs. Temperature 408010060 0.0 20406080100-20 -400 0.8 -40-200 Ambient Temperature(℃) Ambient Temperature(℃) Forward Voltage@20mA Normalize @25℃ Relative Intensity@20mA Normalize @25℃ 0.5 0.5 550500400 0.0 450 Wavelength (nm) Relative Intensity@20mA 1.0 0 1 4.03.01.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Electro-Optical Characteristics Curve Fig.5 Relative Intensity vs. Wavelength PART NO. LSEDBK3342/L1

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 120° Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

0° 0 25° 2°/sec max Time(sec) 150100 5°/sec max 260°C3sec Max 260° Temp(°C) Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSEDBK3342/L1

1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not.Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec High Temperature High Humidity Test Solder Resistance Test Thermal Shock Test (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Item Reliability Test: Operating Life Test Test Condition Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard 6/6PagePART NO. LSEDBK3342/L1