LSE85740-PF LIGITEK | Alldatasheet

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B LSE85740-PF-09 14 - Mar.- 2008 RECTANGLE TYPE LED LAMPS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET DOC. NO : QW0905- REV. : DATE :

1/5PageLSE85740-PFPART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. -60° 75%100%50% -30° 60° 025%25%50%100% 75% 30° 2.54TYP 3.9±0.1 3.8±0.1 1.65±0.1 1.75±0.1 7.0±0.1 0.25MAX 0.5MAX 0.7MAX 0.5±0.05 1.0MIN 25.0MIN

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only μA mW Luminous intensity @10mA(mcd) Viewing angle 2θ 1/2 (deg) 482045 Typ.Min. -40 ~ +100 -40 ~ +85 Ir PD Topr Tstg Storage Temperature Operating Temperature Power Dissipation Reverse Current @5V Spectral halfwidth △λnm Peak wave length λPnm 2.61.745609 LensMin. PART NOMATERIAL OrangeGaAsP/GaPLSE85740-PF Emitted Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Orange Diffused COLOR Forward voltage @ mA(V) Max. Peak Forward Current Duty 1/10@10KHz IFP 80 mA Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ PART NO. LSE85740-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 SE CHIP 3/5PagePART NO. LSE85740-PF

60 Seconds Max

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 2.Wave Soldering Profile 260°C3sec Max Temp(°C) 260° Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 10050Preheat 2°/sec max 120° 0° 0 25° Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 5°/sec max PART NO. LSE85740-PF

MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest Condition 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Item Operating Life Test High Temperature Storage Test Reliability Test: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only JIS C 7021: B-12 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Low Temperature Storage Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solder Resistance Test Solderability Test The purpose of this test is the resistance of the device under tropical for hours. PART NO. LSE85740-PF