LSE65540-L41-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ★ RECTANGLE TYPE LED LAMPS DOC. NO : QW0905- REV. : DATE : LSE65540/L41-PF A - 200719 - Dec. Lead-Free Parts Pb

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only + - 30° 75%25%50% -30° 025%50%75% -60° 100% 60° 100% 0.6MAX 60.0MIN 2.54TYP 1.0MIN 0.45 TYP Page 3.2+0.05 -0.1 2.0+0.05 -0.1 4.0±0.2 1.0MAX PART NO. LSE65540/L41-PF 1/5

Absolute Maximum Ratings at Ta=25 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) mA80IFP Peak Forward Current Duty 1/10@10KHz Orange Diffused Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. GaAsP/GaP Orange61045 Reverse Current @5V Power Dissipation Operating Temperature Storage Temperature Tstg Topr PD Ir -40 ~ +85 -40 ~ +100 mW μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Symbol Forward Current Parameter IF SE Ratings UNIT mA Page 2/5LSE65540/L41-PFPART NO. Viewing angle 2θ 1/2 (deg) Peak wave length λPnm LSE65540/L41-PF EmittedLensMin.Min. Max. 108 Typ. MATERIALPART NO COLOR Luminous intensity @ mA(mcd) Spectral halfwidth △λnm Forward voltage @20mA(V) 2.61.7 4.5

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 SE CHIP Page3/5LSE65540/L41-PFPART NO.

2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 150 Time(sec) 260°C3sec Max 260° Temp(°C) 2°/sec max 10050Preheat 120° 25° 00° Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 5°/sec max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)

60 Seconds Max

LSE65540/L41-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference StandardDescription Reliability Test: Test Item Test Condition The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. High Temperature Storage Test Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Operating Life Test JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Solder Resistance Test Thermal Shock Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles This test intended to see soldering well performed or not.Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 LSE65540/L41-PFPART NO. Page5/5