LSE11241 LIGITEK | Alldatasheet

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DOC. NO : QW0905-LSE11241 REV. : A DATE : 16 - May - 2005 DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT TOWER TYPE LED LAMPS

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions PART NO. LSE11241 Page 1/4 R1.7 1.5MAX 2.54TYP 1.0MIN 25.0MIN 3.0 1.6 □0.5 TYP 2.4 3.3 1.8 -60° -30° 60° 30°

1.7 Min. COLOR Orange Transparent Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. GaAsP/GaP MATERIAL LSE11241 PART NO Orange Emitted Operating Temperature Storage Temperature Soldering Temperature Peakt wave length λPnm Luminous intensity @10mA(mcd) Viewing angle 2θ 1/2 (deg) Forward voltage @20mA(V) Spectral halfwidth △λnm 610 Lens 45 2.6 Max. 12 22 Min. Typ. -40 ~ +100 Max 260℃ for 5 sec Max (2mm from body)Tsol Tstg Topr -40 ~ +85 ℃ Absolute Maximum Ratings at Ta=25 ℃ PART NO. LSE11241 Forward Current Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Power Dissipation Parameter Page 2/4 PD Ir IFP IF Symbol Ratings SE mA mA μA mW UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20-40 402008 0 1 0 0 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700 750 SE CHIP Page3/4 PART NO. LSE11241

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. 1.Ta=105 (10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test Solderability Test Thermal Shock Test High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Reliability Test: PART NO. LSE11241 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Test Condition 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, + 72hrs) High Temperature Storage Test Low Temperature Storage Test Operating Life Test Test Item Description Page 4/4 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard