LSD815-62U-XX-PF

LSD815-62U-XX-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOC. NO : QW0905- REV. : A DATE : - 20094 - May. SINGLE DIGIT LED DISPLAY (0.8 Inch) Lead-Free Parts Pb

2.54X7 =17.78 (0.7") 27.5 (1.083") 20.3 (0.8") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 15.24(0.6") Ø 0.51 TYP LSD815/62U-XX-PF LIGITEK PIN 6 5.0±0.5 ψ2.2(0.087") PIN 9 19.7(0.776") Package Dimensions LSD815/62U-XX-PF PIN NO.1 PIN 1 PART NO. 8.2(0.323") PIN 16 Page1/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

3,5,11,16 D AC B 11214 GEF LDPRDP 41329 6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSD8152U-XX-PF 3,5,11,16 DAC B Internal Circuit Diagram LSD815/62U-XX-PF PART NO. GFE LDPRDP Page 2/8

PIN NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Common Cathode55 Anode G13 Common Cathode Anode B No Pin 15 Common Cathode Anode RDP9 Anode D Anode C Anode LDP No Pin No Pin Electrical Connection PIN NO. PART NO. Common Cathode LSD8152U-XX-PF Anode F Anode E4 Anode A1 LSD815/62U-XX-PF Common Anode Cathode G Cathode B Common Anode No Pin Cathode RDP Cathode D Common Anode Cathode C Cathode LDP No Pin No Pin LSD8162U-XX-PF Cathode F Common Anode Cathode E Cathode A Page3/8

Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ LSD8152U-XX-PF LSD8162U-XX-PF PART NO common cathode or anode CHIP Common Anode Common Cathode AlGaInP Green EmittedMaterial 574 20 λD (nm) (nm) Electrical Iv(mcd) 1.72.12.610.5 Typ. Vf(v) Min.Min. Max. 15.252:1 IV-M Typ. Electrostatic Discharge( * ) Parameter Operating Temperature Storage Temperature Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Power Dissipation Forward Current LSD815/62U-XX-PF Absolute Maximum Ratings at Ta=25 ℃ PART NO. Green -25 ~ +85 -25 ~ +85 ESD Tstg Topr Ir PD IF IFP 2000 V 75 mA μA mW mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Symbol Ratings UNIT 4/8Page

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only If=20mA If=10mA If=20mA If=20mA Test Condition Vr=5V Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width Dominant Wavelength Luminous Intensity Per Chip Forward Voltage Per Chip μAIr IV-M λD Iv Vf nm nm mcd volt Test Condition For Each Parameter LSD815/62U-XX-PF PART NO. Parameter Symbol Unit 5/8Page

Fig.4 Relative Intensity vs. Temperature Fig.2 Relative Intensity vs. Forward Current LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 Typical Electro-Optical Characteristics Curve Forward Voltage@20mA Normaliz @25℃ Relative Intensity @20mA Normalize @25℃ Wavelength (nm) 500 Fig.5 Relative Intensity vs. Wavelength Relative Intensity @20mA 0.5 1.0 0.8 -20 0.9 550 600650 Ambient Temperature(℃) 020406080 0.5 Forward Current(mA) Relative Intensity Normalize @20mA Fig.3 Forward Voltage vs. Temperature 1.2 1.0 1.1 2.5 1.0 1.5 2.0 Forward Voltage(V) 1.0 Fig.1 Forward current vs. Forward Voltage LSD815/62U-XX-PF PART NO. UG CHIP 60 2.0 Ambient Temperature(℃) -20020406080 Forward Current(mA) 101001000 Page 6/8

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Second Max

25° 00° 120° Temp(°C) 260° 260°C3sec Max 5°/sec max 2°/sec max Preheat 50 100 Time(sec) 150 LSD815/62U-XX-PF 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8

This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to see soldering well performed or not. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles Thermal Shock Test High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature Storage Test Low Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Test Condition LSD815/62U-XX-PF PART NO. Reliability Test: Test Item Description Page8/8 Reference Standard