LSD515-61-XX LIGITEK | Alldatasheet
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DOC. NO : QW0905- REV. : B DATE : - 2004 LSD515/61-XX LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TEL:(02)22677686(REP) FAX:(02)22675286,(02)22695616 SINGLE DIGIT LED DISPLAY (0.56 Inch)
A G Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LSD515/61-XX LIGITEK PIN NO.1 0.51 TYP. 14.2 (0.56") 4.3±0.5 E D F DP C B 15.24 (0.60") 8.0 (0.315") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSD515/61-XX Package Dimensions PART NO. 1/7Page 2.46X4= 9.84(0.387") 19.0 (0.748") ψ1.7(0.067") 12.6 (0.496")
3,8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSD5151-XX 3,8 B A C D B 7 6 A 4 2 C D Internal Circuit Diagram PART NO. 1019 EF DPG 101 9 E F DPG Page 2/7LSD515/61-XX
PIN NO. LSD5161-XXPIN NO. LSD5151-XX Common Cathode Common Cathode 10. 9. Anode Anode G F Anode Anode Anode A B DP Anode Anode Anode C E D Cathode Cathode 10. 9. F G Cathode Cathode Cathode Cathode Cathode Common Anode Common Anode Cathode DP A B C E D PART NO. Electrical Connection LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7LSD515/61-XX
1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Iv(mcd) Typ. Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LSD5161-XX Common Anode Reverse Current Per Any Chip Part Selection And Application Information(Ratings at 25 )℃ Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ LSD5151-XX PART NO GaP Material Emitted Red CHIP Forward Current Per Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Operating Temperature Storage Temperature (nm) common cathode or anode Common Cathode 697 90 λP (nm) Electrical Min. Typ. 1.7 2.1 Vf(v) Min.Max. 2.6 0.6 Ir Tstg Topr PD IF IFP -25 ~ +85 -25 ~ +85 Absolute Maximum Ratings at Ta=25 ℃ PART NO. Parameter Symbol Ratings H 2:1 IV-M μA μA℃ mW mA mA UNIT Page 4/7LSD515/61-XX
If=20mAvoltVf Forward Voltage Per Chip Luminous Intensity Per Chip Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio Peak Wavelength λp IV-M μAIr Iv nm nm mcd Vr=5V If=20mA If=20mA If=10mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter Test Condition For Each Parameter PART NO. Symbol Unit Test Condition Page 5/7LSD515/61-XX
Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700 800 900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200- 4 0 100 0.0 80600 20 40 100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA)0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 10 100 1000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 6/7PART NO. PageLSD515/61-XX
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) Operating Life Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Solder Resistance Test Solderability Test High Temperature Storage Test Low Temperature Storage Test Thermal Shock Test High Temperature High Humidity Test MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Test Condition Reliability Test: PART NO. Test Item Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only