LSD511-2SBKS-XX-PF LIGITEK | Alldatasheet

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06 - Mar. LSD511/2SBKS-XX-PF Lead-Free Parts DOC. NO : QW0905- REV. : B DATE : - 2007 SINGLE DIGIT LED DISPLAY (0.56 Inch) LSD511/2SBKS-XX-PF DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

8.0 (0.315") PageLSD511/2SBKS-XX-PF 12.5 (0.492") 2.32.3 2.54X2 Ø 0.51 TYP 4.2±0.5 ψ1.6(0.063") 15.2 (0.598") 14.2 (0.56") 19.0 (0.748") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only E C PIN NO.1 LSD511/2SBKS-XX-PF LIGITEK D DP G F B A

PART NO.LSD511/2SBKS-XX-PF 2/8Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Internal Circuit Diagram LSD511SBKS-XX-PF 3,8 AF 26 41 9 CBE D 105 DPG AF 91462 BCDE 510 DPG LSD512SBKS-XX-PF 3,8

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO. LSD511SBKS-XX-PF PIN NO. Electrical Connection LSD512SBKS-XX-PF Anode DP Anode D Common Cathode Anode C Common Anode Anode E Cathode E Anode B Anode A Anode F Anode G Common Cathode Cathode D Cathode C Cathode DP Cathode B Cathode A Cathode F Cathode G Common Anode PART NO.

℃-25 ~ +85Tstg Storage Temperature Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ λD (nm) 460 Part Selection And Application Information(Ratings at 25)℃ InGaN/SiC Material LSD511SBKS-XX-PF PART NO Common Cathode Common Anode Bule common cathode or anodeEmitted CHIP Electrical Max. 3.526 4.2 Typ. (nm) Vf(v) 2:18.512.8 IV-M Min. Typ. Iv(mcd) Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Operating Temperature Reverse Current Per Any Chip Topr PD Ir Forward Current Per Chip Parameter IFP IF Symbol -20 ~ +80 120 μA mW 100 Ratings SBKS mA mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Absolute Maximum Ratings at Ta=25 ℃ Page4/8 LSD512SBKS-XX-PF V500ESD Electrostatic Discharge( * ) Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. PART NO.LSD511/2SBKS-XX-PF

Luminous Intensity Matching Ratio Parameter Luminous Intensity Per Chip Dominant Wavelength Forward Voltage Per Chip Ir μA nm Vr=5V If=20mA Iv λD Vf mcd nm volt Unit If=10mA If=20mA If=20mA Test Condition Test Condition For Each Parameter LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/8 PART NO.LSD511/2SBKS-XX-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Electro-Optical Characteristics Curve 215 43 Fig.4 Relative Intensity vs. Wavelength Forward Current(mA) Forward Current@20mA Relative Intensity@20mA Ambient Temperature(℃) 2550100 75 430 380 Fig.3 Forward Current vs. Temperature Forward Voltage(V) 0.5 1.0 530 480 480 580 Wavelength (nm) 680 630 151020 3025 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage Forward Current(mA) SBK-S CHIP Relative Intensity Normalize @20mA 1.25 0.25 0.5 1.0 0.75 1.5 PART NO.LSD511/2SBKS-XX-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 260°C3sec Max 5°/sec max 100 2°/sec max Preheat 50 260° Temp(°C) 120° 25°

60 Seconds Max

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. PART NO.LSD511/2SBKS-XX-PF

Reliability Test: The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Operating Life Test High Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test Low Temperature Storage Test (10min) (10min) 2.total 10 cycles 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test ItemTest Condition Description This test intended to see soldering well performed or not. Solder Resistance Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard PART NO.LSD511/2SBKS-XX-PF