LSD505-61-XX-RP3 LIGITEK | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 8

Technical content

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOC. NO : QW0905- REV. : B DATE : - 200524 - Jan LSD505/61-XX/RP3 LSD505/61-XX/RP3 DATA SHEET SINGLE DIGIT LED DISPLAY (0.5lnch)

8.0 (0.315") 12.7 (0.5") LSD505/61-XX/RP3 LIGITEK 2.45X4=9.8 (0.386") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. □0.51 TYP PIN NO.1 12.7 (0.50") 3.0±0.5 19.0 (0.748") ψ1.5(0.059") 15.24 (0.60") LSD505/61-XX/RP3 PART NO. Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7

3,8 LSD5061-XX/RP3 3,8 976 A B 214 DC E 21764 A B DC E 510 GF DP 510 GF DP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSD505/61-XX/RP3 Internal Circuit Diagram PART NO. 2/7Page

PART NO. PIN NO. Electrical Connection Common Cathode Anode DP Anode F Anode G Anode A Anode B Common Cathode LSD5051-XX/PR3 Anode E Anode C Anode D2 Cathode B Cathode DP Cathode F Common Anode Cathode A Cathode G Cathode D Cathode E Cathode C Common Anode PIN NO. LSD5061-XX/PR3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSD505/61-XX/RP3 3/7 Page

Part Selection And Application Information(Ratings at 25 )℃ Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Tstg LSD5061-XX/RP3 LSD5051-XX/RP3 PART NO Storage Temperature Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Anode Common Cathode common cathode or anode CHIP Material GaP GaP Red Red Emitted 697 697 λp (nm) (nm) 2.1 2.1 1.7 1.7 2.6 2.6 Vf(v) Typ.Min. Max. -25 ~ +85 PART NO. Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1M=ms Pulse Width) Operating Temperature Reverse Current Per Any Chip Symbol IFP PD Topr Ir Parameter IF -25 ~ +85 Ratings H LSD505/61-XX/RP3 0.35 0.5 0.35 0.5 2:1 2:1 Typ.Min. Iv(mcd) IV-M μA mW mA mA UNIT Page 4/7

Test Condition For Each Parameter Luminous Intensity Per Chip Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio Peak Wavelength Forward Voltage Per Chip Parameter PART NO. LSD505/61-XX/RP3 Test Condition IV-M Ir μA nm λp Iv Vf Symbol mcd nm volt Unit If=20mA Vr=5V If=10mA If=20mA If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5/7Page

Relative Intensity@20mA Normalize @25℃ 2.0 1.1 Forward Voltage@20mA Normalize @25℃ -20 Relative Intensity@20mA 800 Wavelength (nm) 600 700 900 1000 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength 0.5 0.0 1.0 0.9 1.0 0.8 -40 -20 0 20 40 60 80 100 0.0 -40 1.0 0.5 1.5 Ambient Temperature(℃) 602004 0 1 0 0 80 Fig.2 Relative Intensity vs. Forward Current Fig.4 Relative Intensity vs. Temperature LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only H CHIP 3.0 Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA)0.1 1.2 1.0 2.0 1000 1.0 100 Relative Intensity Normalize @20mA 0.5 4.0 5.0 2.5 3.0 1.0 0.0 2.5 1.5 1.0 2.0 3.0 LSD505/61-XX/RP3 Typical Electro-Optical Characteristics Curve PART NO. Forward Current(mA) 10 100 1000 Page 6/7

PART NO. Reliability Test: Test Item High Temperature Storage Test Low Temperature Storage Test Operating Life Test High Temperature High Humidity Test Thermal Shock Test Solder Resistance Test Solderability Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) Test Condition The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hous.

Description

This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. LSD505/61-XX/RP3 Page 7/7