LSD3E65-XX-PF

LSD3E65-XX-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : A DATE : - 2006 DATA SHEET SINGLE DIGIT LED DISPLAY (0.39 Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 27 - Jun. LSD3E65-XX-PF Pb Lead-Free Parts

Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSD3E65-XX-PF 1/8Page ψ1.2(0.047") 7.0 (0.276") 131 14.0 (0.551") 3.5±0.5Ø 0.45 TYP 7.5(0.295") 2.35X2=4.7 (0.185") PIN NO.1 C 10.0 (0.39") E D MN L F H KJ G1 G2 A B LSD3E65-XX-PF LIGITEK 9.9 (0.39") 11.0 (0.433") 9.76 (0.384") 5.08 (0.2")

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2/8Page 101316 A B 9 6 5111415 212 4 3 7 8 K LSD3E65-XX-PF G1EDCF HG2 JDP MLN LSD3E65-XX-PF PART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Electrical Connection Cathode F Common Anode Cathode G1 Cathode H PIN NO. LSD3E65-XX-PF 3/8Page Cathode D Cathode C Cathode L Cathode G2 Cathode B Cathode K Cathode J Cathode A Cathode DP LSD3E65-XX-PF PART NO.

Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Material GaAlAs CHIP LSD3E65-XX-PF PART NO Electrical Common Anode Red 6601.5 202.4 1.8 λP (nm) common cathode or anodeEmittedMin. (nm) Typ. Max. Vf(v) 2:13.055.0 IV-M Typ.Min. Iv(mcd) Reverse Current Per Any Chip Operating Temperature Storage Temperature Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260℃ Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25℃ Parameter IF mA30 Topr Tstg -25 ~ +85 -25 ~ +85 Ir PD IFP 100 100 μA mW mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Symbol Ratings SR UNIT 4/8PageLSD3E65-XX-PF PART NO.

Luminous Intensity Matching Ratio Test Condition For Each Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip △λ nm Ir IV-M μA λP Iv nm mcd If=20mA Vr=5V If=10mA If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter Symbol Vf Unit volt Test Condition If=20mA Page5/8LSD3E65-XX-PF PART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 6/8LSD3E65-XX-PF PART NO.

60 Seconds Max

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C 150100 Time(sec) 2°/sec max Preheat 50 260°C3sec Max 5°/sec max 120° 260° 25° Temp(°C) LSD3E65-XX-PF PART NO.

This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Item Operating Life Test Reliability Test: Test Condition 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. High Temperature High Humidity Test High Temperature Storage Test Low Temperature Storage Test Thermal Shock Test Solder Resistance Test 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.T.Sol=260℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test This test intended to see soldering well performed or not. 1.T.Sol=230℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 LSD3E65-XX-PF PART NO.