LSD3C5-65-R1-XX-KP4-PF

LSD3C5-65-R1-XX-KP4-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOC. NO : QW0905- REV. : A DATE : 05 - Dec.- 2005 LSD3C5/65/R1-XX/KP4-PF DATA SHEET LSD3C5/65/R1-XX/KP4-PF SINGLE DIGIT LED DISPLAY (0.31 Inch) Lead-Free Parts Pb

2.0X4=8.0 (0.315") 11.0 (0.433") 8.0 (0.31") ψ0.9(0.035") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 5.3(0.209") 0.3 TYP 7.0(0.276") LSD3C5/65/R1-XX/KP4-PF PART NO. Package Dimensions LIGITEK PIN NO.1 LSD3C5/65/R1-XX/KP4-PF 5.0(0.197") Page1/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 4.0±0.5 0.5 TYP

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only A Internal Circuit Diagram LSD3C55/R1-XX/KP4-PF B C D E GF PART NO.Page 2/8LSD3C5/65/R1-XX/KP4-PF

PIN NO.1 Anode B10 Anode DP Anode C Common Cathode Cathode DP Cathode B10 Anode DP Cathode DP Cathode C Common Anode9 LSD3C65/R1-XX/KP4-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Anode A1 Anode D Anode E Anode G Anode F LSD3C55/R1-XX/KP4-PF Cathode A1 Cathode F Cathode G Cathode E Cathode D5 PIN NO.1 PART NO.Page3/8LSD3C5/65/R1-XX/KP4-PF

Typ. μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5.0 LSD3C55/R1-XX/KP4-PF LSD3C65/R1-XX/KP4-PF PART NO Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. λP (nm) 660 common cathode or anodeEmitted GaAlAs Red Material CHIP Common Cathode Common Anode Electrical Typ. Vf(v) 1.8201.5 (nm) Min. 2.4 3.05 Max.Min. Iv(mcd) Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Storage Temperature Operating Temperature Reverse Current Per Any Chip Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Absolute Maximum Ratings at Ta=25 ℃ SymbolParameter Tstg Topr Ir PD IFP IF -25 ~ +85 -25 ~ +85 100 100 SR Ratings 2:1 IV-M PART NO.Page 4/8LSD3C5/65/R1-XX/KP4-PF

Test Condition For Each Parameter Parameter Forward Voltage Per Chip Spectral Line Half-Width Peak Emission Wavelength Luminous Intensity Per Chip Luminous Intensity Matching Ratio Reverse Current Any Chip UnitTest ConditionSymbol If=20mA If=10mA If=20mA If=20mA Vr=5V IV-M Ir μA Iv λP Vf mcd nm nm volt LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.Page5/8LSD3C5/65/R1-XX/KP4-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP PART NO.Page6/8LSD3C5/65/R1-XX/KP4-PF

PART NO. Page 7/8 Time(sec) 150 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 5°/sec max 260°C3sec Max 10050 260° Temp(°C) 25°

0 Preheat

120°

60 Seconds Max

2°/sec max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSD3C5/65/R1-XX/KP4-PF

Reliability Test: Solderability Test Thermal Shock Test High Temperature High Humidity Test Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hous. This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. Test Item Test Condition Description PART NO. Page8/8LSD3C5/65/R1-XX/KP4-PF