LSD3922-XX-P7-PF

LSD3922-XX-P7-PF LIGITEK | Alldatasheet

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LSD3922-XX/P7-PFDOC. NO : QW0905- REV. : A DATE : 30 - Aug. - 2007 SINGLE DIGIT LED DISPLAY (0.3 Inch) LSD3922-XX/P7-PF DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. LSD3922-XX/P7-PF Package Dimensions PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page1/8 ψ1.1 15.0±0.5 10.06 (0.39") 7.62 (0.3") LSD3922-XX/P7-PF LIGITEK 7.8 (0.31") PIN NO.1 2.54X6= 15.24(0.6") 19.0 (0.75") 5.4 (0.21") Ø 0.45 TYP. 4.7 PIN 1 PIN 7 PIN 8 PIN 14

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Internal Circuit Diagram PART NO. 2/8LSD3922-XX/P7-PF LSD3922-XX/P7-PF 131 A 1082 7119 G 3,14 DCB FE RDP PIN4,5,6,12:NO PIN

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO. PART NO. Electrical Connection 3/8PageLSD3922-XX/P7-PF LSD3922-XX/P7-PF Cathode A Cathode F Common Anode No Pin No Pin Cathode E Cathode D Cathode RDP Cathode C Cathode G No Pin Cathode B

14 Common Anode

Reverse Current Per Any Chip Ir 10 μA Operating Temperature Storage Temperature LSD3922-XX/P7-PF PART NO Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. -25 ~ +85 -25 ~ +85 Material GaP Green Emitted CHIP △λ (nm) λP (nm) common cathode or anode 56530 Tstg Topr Max. 2.61.72.1 Min. Typ. 1.753.05 Min. Typ. Electrical Vf(v)Iv(mcd) IV-M 2:1 Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter PD IFP IF Symbol UNIT mA mA mW100 120 G Page 4/8 Common Anode LSD3922-XX/P7-PF PART NO.

Vr=5VIr IV-M Luminous Intensity Matching Ratio Symbol Test Condition For Each Parameter Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip mcdIv λP nm μA nm Unit Vf volt If=10mA If=20mA If=20mA Test Condition If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page5/8LSD3922-XX/P7-PF PART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP Fig.6 Directive Radiation 6/8LSD3922-XX/P7-PF PART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 260°C3sec Max 5°/sec max 100 2°/sec max Preheat 50 260° Temp(°C) 120° 25°

60 Seconds Max

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LSD3922-XX/P7-PF PART NO.

MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Thermal Shock Test Solder Resistance Test High Temperature High Humidity Test (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Low Temperature Storage Test High Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reliability Test: Test Item Operating Life Test Test Condition Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page8/8LSD3922-XX/P7-PF PART NO.