LSD375-61-XX-PF

LSD375-61-XX-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT LED DISPLAY (0.39Inch) DATA SHEET LSD375/61-XX-PF 26 - Mar.-2007 DOC. NO : QW0905- REV. : A DATE : LSD375/61-XX-PF

2.54X4= 10.16 (0.4") 6.9(0.272")PIN NO.1 LSD375/61-XX-PF LIGITEK 10.0 (0.39) Ø0.45 TYP 7.62 (0.3") 9.85(0.388") 12.9 (0.508") 4.8±0.5 ψ1.2(0.047") 1/8Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Package Dimensions LSD375/61-XX-PF Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice.

1,6 G DPEDCB FA G DP DEBC 2489 5 FA LSD3751-XX-PF 1,6 LSD375/61-XX-PF2/8 PART NO. Internal Circuit Diagram LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 105 98 42 3 7

PART NO. PIN NO. LSD3751-XX-PF PIN NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Common Cathode Anode G Common Cathode Anode C Common Anode Cathode G Common Anode Cathode C

H 40 mW mA mA UNITSymbol IF IFP PD Parameter LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) 2:1 IV-MIv(mcd)Vf(v) Electrical Typ.Min. 0.80.5 Typ.Min. 2.11.72.6 Max. Topr Tstg Common Anode 697 common cathode or anode λP (nm) (nm) CHIP Emitted Red GaP Material -25 ~ +85 -25 ~ +85 Common Cathode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ PART NO LSD3761-XX-PF LSD3751-XX-PF Storage Temperature Operating Temperature μA10Ir Reverse Current Per Any Chip PART NO.LSD375/61-XX-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only If=20mA Test Condition If=20mA If=20mA If=10mA voltVf Unit nm μA nm λP Iv mcd Reverse Current Any Chip Spectral Line Half-Width Forward Voltage Per Chip Peak Wavelength Luminous Intensity Per Chip Parameter Test Condition For Each Parameter Symbol Luminous Intensity Matching Ratio IV-M IrVr=5V PART NO.LSD375/61-XX-PF

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 6/8Page PART NO.LSD375/61-XX-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 260°C3sec Max 5°/sec max 100 2°/sec max Preheat 50 260° Temp(°C) 120° 25°

60 Seconds Max

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. PART NO.LSD375/61-XX-PF

Reliability Test: The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Operating Life Test High Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test Low Temperature Storage Test (10min) (10min) 2.total 10 cycles 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test ItemTest Condition Description This test intended to see soldering well performed or not. Solder Resistance Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard PART NO.LSD375/61-XX-PF