LSD355-6DBK-XX-PF LIGITEK | Alldatasheet
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT LED DISPLAY (0.39Inch) LSD355/6DBK-XX-PFDOC. NO : QW0905- REV. : B DATE : 18 - Nov.-2010 DATA SHEET LSD355/6DBK-XX-PF
7.0 (0.276") 2.54X4= 10.16 (0.4") PART NO. Package Dimensions LSD355/6DBK-XX-PF 9.85 (0.388")PIN NO.1 LSD355/6DBK-XX-PF LIGITEK 7.62 (0.3") Ø 0.45 TYP 10.0 (0.394) 12.9 (0.508") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. ψ1.2(0.047") 5.0±0.5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only A B C DPD E F G
3,8 D PART NO. Internal Circuit Diagram LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 124610 95 7 DPFE GCB A D LSD356DBK-XX-PF 3,8 612459710
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3/8Page PIN NO. LSD356DBK-XX-PF Cathode E4
3 Common Anode
PART NO.LSD355/6DBK-XX-PF Electrical Connection PIN NO.
2 Anode F
6 Anode DP
7 Anode C
10 Anode A
5 Cathode D Anode D5
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. V500ESD Electrostatic Discharge( * ) LSD355/6DBK-XX-PF PART NO. Page UNIT Symbol Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only mA mA mW μA DBK 30IF 120 100 PD IFP 50Ir Tstg Topr -25 ~ +85 -25 ~ +85 Reverse Current Per Any Chip Operating Temperature Storage Temperature Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Parameter Electrical Typ.Typ. Max.Min. 4.03.5 1826 2:1 Vf(v)Iv(mcd) IV-M CHIP Min. 47030---- EmittedMaterial InGaN/GaN Blue Common Cathode Common Anode (nm) λD (nm) common cathode or anode LSD355DBK-XX-PF LSD356DBK-XX-PF PART NO Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Symbol Forward Voltage Per Chip Dominant Wavelength Luminous Intensity Per Chip Parameter Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width IV-M Ir Iv λD Vf PART NO. LSD355/6DBK-XX-PF Test Condition For Each Parameter Test ConditionUnit μA Vr=5V mcd nm nm volt If=10mA If=20mA If=20mA If=20mA Page5/8
Fig.5 Relative Intensity vs. Wavelength Typical Electro-Optical Characteristics Curve LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.03.04.0 0 1 1.0 Relative Intensity@20mA Wavelength (nm) 450 0.0 400500550 0.5 0.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃)Ambient Temperature(℃) 0-20-40 0.8 0-40-2010080604020 0.0 601008040 Fig.4 Relative Intensity vs. Temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity Normalize @20mA Forward Current(mA) Forward Current(mA)Forward Voltage(V) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage 2.5 3.0 100 1000 DBK CHIP PART NO. LSD355/6DBK-XX-PF Page6/8
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 150 5°/sec max 260°C3sec Max 260° 100 2°/sec max 120° 25°
500 Preheat
60 Seconds Max
Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Temp(°C)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference StandardDescription 8/8Page JIS C 7021: B-12 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Test ConditionTest Item Reliability Test: PART NO.LSD355/6DBK-XX-PF Low Temperature Storage Test High Temperature Storage Test Operating Life Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles