LSD355-66F-XX-PF

LSD355-66F-XX-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : A DATE : 05 - Jun.-2009 LSD355/66F-XX-PF DATA SHEET SINGLE DIGIT LED DISPLAY (0.39Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb 發行 DCC 立碁電子

2.54X4= 10.16 (0.4") 12.9 (0.508") 10.0 (0.394) Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. ψ1.2(0.047") 5.0±0.5Ø 0.45 TYP 7.62 (0.3") LSD355/66F-XX-PF LIGITEK PIN NO.1 9.85 (0.388") Package Dimensions LSD355/66F-XX-PF PART NO. 7.0 (0.276") Page1/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 10 91 45726 LSD3566F-XX-PF 3,8 B A 10 9 GEDCF DP 12457 6 LSD355/66F-XX-PF LSD3556F-XX-PF 3,8 AB PART NO. Internal Circuit Diagram GDC EF DP

PIN NO.PIN NO.

5 Cathode D Anode D5

10 Anode A

10 Cathode A

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSD3566F-XX-PF LSD355/66F-XX-PF LSD3556F-XX-PF Common Cathode Electrical Connection Anode E Anode F Anode G PART NO. Common Anode Cathode E4 Cathode F Cathode G 3/8Page

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) PART NO. 2:1 IV-MIv(mcd)Vf(v) Electrical Typ.Min. 12.88.5 Typ.Min. 1.71.52.4 Max. Topr Tstg 20630 common cathode or anode λD (nm) (nm) CHIP Emitted RedAlGaInP Material -25 ~ +85 -25 ~ +85 Common Cathode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ PART NO LSD3566F-XX-PF LSD3556F-XX-PF Storage Temperature Operating Temperature μA10Ir Reverse Current Per Any Chip Electrostatic Discharge( * ) ESD 2000 V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only If=20mA Test Condition If=20mA If=20mA If=10mA voltVf Unit nm μA nm λD Iv mcd PART NO. Reverse Current Any Chip Spectral Line Half-Width Forward Voltage Per Chip Dominant Wavelength Luminous Intensity Per Chip Parameter Test Condition For Each Parameter Symbol Luminous Intensity Matching Ratio IV-M IrVr=5V

Relative Intensity@20mA 600 Wavelength (nm) 550 700650 0.5 0.5 Relative Intensity@20mA Normalize@25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength 1.0 Ambient Temperature(℃) 0.8 -0-20-4060 402080100 -40-20-060 4080100 Fig.4 Relative Intensity vs. Temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 Fig.3 Forward Voltage vs. Temperature 1.2 3.0 100 Relative Intensity Normalize @20mA Forward Current(mA) Forward Current(mA)Forward Voltage(V) 1.51.0 0.1 2.52.03.01.010 1.0 0.5 1.0 1.5 2.0 1001000 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage 1000 3.5 2.5 Typical Electro-Optical Characteristics Curve LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3.0 HRF CHIP PART NO. LSD355/66F-XX-PF Page6/8

PART NO.LSD355/66F-XX-PF Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C

60 Seconds Max

25° 120° Temp(°C) 260° 50Preheat 2°/sec max 100 5°/sec max 260°C3sec Max 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8

PART NO. LSD355/66F-XX-PF Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test Solder Resistance Test This test intended to see soldering well performed or not. DescriptionTest ConditionTest Item 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles Low Temperature Storage Test Thermal Shock Test High Temperature High Humidity Test High Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Reliability Test: 8/8Page