LSD355-62-XX-PF

LSD355-62-XX-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT LED DISPLAY (0.39Inch) DATA SHEET LSD355/62-XX-PF 18 - Apr.-2007 DOC. NO : QW0905- REV. : A DATE : LSD355/62-XX-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1/8Page 7.0 (0.276") PART NO.LSD355/62-XX-PF Package Dimensions 9.85 (0.388")PIN NO.1 LSD355/62-XX-PF LIGITEK 7.62 (0.3") Ø 0.45 TYP 5.0±0.5 ψ1.2(0.047") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 10.0 (0.394) 12.9 (0.508") 2.54X4= 10.16 (0.4")

PART NO. B A LSD3552-XX-PF 3,8 LSD355/62-XX-PF 675421 DPFC D E G 910 AB LSD3562-XX-PF 3,8 627541910 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page

PIN NO. Cathode G Cathode F

4 Cathode E

PART NO. PIN NO. Anode G Anode F Anode E Electrical Connection Common Cathode LSD3552-XX-PF LSD355/62-XX-PF LSD3562-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

6 Cathode DP

5 Anode D Cathode D 5

μA IV-MIv(mcd) mW 2:1 Min. 1.75 Typ. 3.05 3.051.752:1 G 120 Ratings IF Parameter Symbol IFP -25 ~ +85 -25 ~ +85 Vf(v) Ir CHIP Topr Tstg 100PD Forward Current Per Chip Operating Temperature Power Dissipation Per Chip Reverse Current Per Any Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Absolute Maximum Ratings at Ta=25 ℃ Storage Temperature PART NO Max. 2.6 Min. 1.7 Typ. 2.1 2.62.11.7 30565 30565 Emitted Green Green GaP GaP Material Common Cathode Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LSD3562-XX-PF LSD3552-XX-PF (nm) λP (nm) common cathode or anode LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Electrical Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25)℃ PART NO.LSD355/62-XX-PF

If=20mA If=20mA If=20mA If=10mA Unit volt mcd nm nm Vf Symbol λp Iv LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Test Condition Vr=5VμAIr IV-M Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio Test Condition For Each Parameter PART NO.LSD355/62-XX-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP Fig.6 Directive Radiation 6/8 PART NO.LSD355/62-XX-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 260°C3sec Max 5°/sec max 100 2°/sec max Preheat 50 260° Temp(°C) 120° 25°

60 Seconds Max

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. PART NO.LSD355/62-XX-PF

Reliability Test: The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Operating Life Test High Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test Low Temperature Storage Test (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test ItemTest Condition Description This test intended to see soldering well performed or not. Solder Resistance Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard PART NO.LSD355/62-XX-PF