LSD335-66-XX-RP38-PF

LSD335-66-XX-RP38-PF LIGITEK | Alldatasheet

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LSD335/66-XX/RP38-PFDOC. NO : QW0905- REV. : A DATE : - 200531 - May SINGLE DIGIT LED DISPLAY (0.32 Inch) LSD335/66-XX/RP38-PF DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb

Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. LSD335/66-XX/RP38-PF Package Dimensions PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 LSD335/66-XX/RP38-PF LIGITEK 8.0 (0.315") 6.50 (0.256") ψ1.0 0.5(0.02") 3.8±0.5 13.0 (0.51") PIN NO.1 7.5 (0.30") 5.08 (0.20") 10.16 (0.40") ψ0.45 TYP

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Internal Circuit Diagram PART NO. 2/8LSD335/66-XX/RP38-PF LSD3356-XX/RP38-PF 1,6 A F 598 42 CB ED 3 7 DPG A FB C D E DPG LSD3366-XX/RP38-PF 1,6

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO. LSD3356-XX/RP38-PF PIN NO. PART NO. Electrical Connection LSD3366-XX/RP38-PF 3/8PageLSD335/66-XX/RP38-PF Anode D Anode F Anode E Anode DP Anode B Anode A Cathode F Cathode E Cathode D Cathode DP Cathode B Cathode A

Reverse Current Per Any Chip Ir 10 μA Operating Temperature Storage Temperature LSD3356-XX/RP38-PF LSD3366-XX/RP38-PF PART NO Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25 )℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Cathode -25 ~ +85 -25 ~ +85 Material GaAlAs Red Emitted CHIP △λ (nm) λP (nm) common cathode or anode 660 20 Tstg Topr Max. 2.41.5 1.7 Min. Typ. 3.05 6.1 Min. Typ. Electrical Vf(v) Iv(mcd) IV-M 2:1 PART NO. Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter PD IFP IF Symbol UNIT mA mA mW100 100 HR Page 4/8LSD335/66-XX/RP38-PF Common Anode

Vr=5VIr IV-M Luminous Intensity Matching Ratio Symbol Test Condition For Each Parameter Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip PART NO. mcdIv λP nm μA nm Unit Vf volt If=10mA If=20mA If=20mA Test Condition If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/8LSD335/66-XX/RP38-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity@20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0 10 100 1000 0.5 -40 -20 -0 20 600 650 2.0 3.0 4.0 5.0 40 60 0.8 -0-20-40 40 60 20 0.5 0.9 1.0 1.1 1.2 1.0 1.5 2.0 650 700 750 0.5 1.0 1.0 1.5 2.0 2.5 3.0 10080 10080 2.5 3.0 HR CHIP Page6/8 PART NO. LSD335/66-XX/RP38-PF

120 Seconds Max

Soldering Iron:30W Max Temperature 300 °C Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) Dip Soldering Preheat: 120 °C Max Preheat time: 120 seconds Max Ramp-up 3°C/sec(max) Ramp-Down:-5 °C/sec(max) Solder Bath:245 °C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) Soldering Iron:30W Max Temperature:350 ° CMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case) Dip Soldering Preheat: 140°C Max Preheat time: 120seconds Max Ramp-up 3°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:265° C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case) Preheat Time(sec) 265°C 5sec Max 25° 140° 3°/sec max 265° Temp(°C) 5°/sec max Wave Soldering Profile (Pb Free) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Temp(°C) 245°C 5sec Max 25° Preheat 3°/sec max 120° 245° Time(sec) 5°/sec max Wave soldering Profile PART NO. LSD335/66-XX/RP38-PF Page 7/8

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles Solder Resistance Test High Temperature High Humidity Test Thermal Shock Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reliability Test: PART NO. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test Item Test Condition JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference StandardDescription 8/8PageLSD335/66-XX/RP38-PF