LSD215-61-XX-HF

LSD215-61-XX-HF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET LSD215/61-XX-HF SINGLE DIGIT LED DISPLAY (0.28 Inch) DOC. NO : QW0905- REV. : A DATE : 20 - Feb. - 2009 LSD215/61-XX-HF Lead-Free Parts Pb 發行 DCC 立碁電子

PIN NO.1 1/8Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Package Dimensions LSD215/61-XX-HF Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. LSD215/61-XX-HF LIGITEK 3.5±0.5 ψ0.8(0.032") 7.0 (0.28") 8.15(0.321") 5.08(0.2") 9.85 (0.388") 1 3 5 8 6 6.0 (0.236") 7.62 (0.3") ψ0.45 TYP

LSD215/61-XX-HF PART NO. DPG LSD2151-XX-HF 3,8 10146 2 DECBF DPG FDECB 101462 LSD2161-XX-HF 3,8 A A Internal Circuit Diagram LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page

LSD215/61-XX-HF PART NO. Cathode F Cathode G Cathode A Cathode DP Cathode C Cathode D Anode F Anode G Anode A Anode C Anode D Anode DP Page 3/8 LSD2161-XX-HF Electrical Connection PIN NO. LSD2151-XX-HF PIN NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Common Cathode Anode E Common Cathode Anode B Common Anode Cathode E Common Anode Cathode B

H 40 mW mA mA UNITSymbol IF IFP PD Parameter LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) 2:1 IV-MIv(mcd)Vf(v) Electrical Typ.Min. 0.50.2 Typ.Min. 2.11.7 2.6 Max. Topr Tstg 90697 common cathode or anode λP (nm) (nm) CHIP Emitted Red GaP Material -25 ~ +85 -25 ~ +85 Common Cathode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25 )℃ PART NO LSD2161-XX-HF LSD2151-XX-HF Storage Temperature Operating Temperature μA10Ir Reverse Current Per Any Chip PART NO. LSD215/61-XX-HF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only If=20mA Test Condition If=20mA If=20mA If=10mA voltVf Unit nm μA nm λP Iv mcd Reverse Current Any Chip Spectral Line Half-Width Forward Voltage Per Chip Peak Wavelength Luminous Intensity Per Chip Parameter Test Condition For Each Parameter Symbol Luminous Intensity Matching Ratio IV-M Ir Vr=5V PART NO. LSD215/61-XX-HF

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700 800 900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200- 4 0 100 0.0 806002 04 0 1 0 0 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA)0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 10 100 1000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 6/8Page PART NO. LSD215/61-XX-HF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD215/61-XX-HF Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:10 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 10 Seconds At 260°C Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

00° 25° 120° Preheat 50 2°/sec max 260° Temp(°C) Time(sec) 100 5¢X/sec max 150 260°C10sec Max Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reliability Test: 8/8Page PART NO. LSD215/61-XX-HF Solderability Test Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test High Temperature Storage Test Low Temperature Storage Test Operating Life Test Test Item This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Ta=105 (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 DescriptionTest Condition Reference Standard