LSD1805/65-XX-PF

LSD1805-65-XX-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET LSD1805/65-XX-PF SINGLE DIGIT LED DISPLAY (1.8 Inch) DOC. NO : QW0905- REV. : A DATE : - 2008 LSD1805/65-XX-PF 12 - Apr. Lead-Free Parts Pb

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Package Dimensions Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. PIN NO.1 ψ4.5 LSD1805/65-XX-PF LIGITEK 55.8 (2.197") 44.8 (1.764") 48.26 (1.9") 7.3±0.5 ψ0.6 TYP 2.54X4=10.16(0.4") 37.8 (1.488") LSD1805/65-XX-PF 10.8 (0.425") Page1/8 PIN 10 PIN 6 PIN 1 PIN 5

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSD18065-XX-PF LSD18055-XX-PF DPGFED 1,5 CB DP 910 GF ED C 1,5 8910243 A A B PART NO. LSD1805/65-XX-PF Page2/8

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. PIN NO. LSD18055-XX-PF PIN NO. LSD18065-XX-PF Anode DP Anode E Common Cathode Anode C Common Anode Anode D Cathode D Anode B Anode A Anode F Anode G Common Cathode Cathode E Cathode C Cathode DP Cathode B Cathode A Cathode F Cathode G Common Anode LSD1805/65-XX-PF Page3/8

μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mA mW Page LSD18055-XX-PF LSD18065-XX-PF PART NO Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. λP (nm) common cathode or anodeEmitted GaAlAs Red Material Common Cathode Common Anode 660 CHIP △λ (nm) Vf(v)Iv(mcd) 5.0 Typ. 204.5 Min. 12.87.2 21.5 Min.Max. Typ. Electrical Reverse Current Per Any Chip Operating Temperature Storage Temperature Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Parameter IF 30 Tstg Topr PD Ir IFP -25 ~ +85 -25 ~ +85 100 100 Symbol Ratings SR IV-M 2:1 4/8LSD1805/65-XX-PF PART NO.

Test Condition For Each Parameter Forward Voltage Per Chip Luminous Intensity Matching Ratio Luminous Intensity Per Chip Peak Wavelength Spectral Line Half-Width Reverse Current Any Chip Parameter VfvoltIf=20mA Vr=5V If=10mA If=20mA If=20mA IV-M mcd nm μA nm Ir λP Iv Test Condition LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UnitSymbol Page5/8LSD1805/65-XX-PF PART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 6/8LSD1805/65-XX-PF PART NO.

60 Seconds Max

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C 25° 120° Temp(°C) 260° 50Preheat 2°/sec max 100 5°/sec max 260°C3sec Max 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8LSD1805/65-XX-PF PART NO.

This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Item Operating Life Test Reliability Test: Test Condition 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. High Temperature High Humidity Test High Temperature Storage Test Low Temperature Storage Test Thermal Shock Test Solder Resistance Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 LSD1805/65-XX-PF PART NO.