LSD1001-25-XX LIGITEK | Alldatasheet
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET LSD1001/25-XX SINGLE DIGIT LED DISPLAY (1.0 Inch) 01 - Jun. DOC. NO : QW0905- REV. : A DATE : - 2005 LSD1001/25-XX
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Package Dimensions LSD1001/25-XX Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. Ø 0.51 TYP 2.54X6= 15.24 (0.6") 26.0 (1.02") LSD1001/25-XX LIGITEK 15.24 (0.6") 22.5 (0.89") 33.0 (1.3") 6.0±0.5 ψ2.5(0.1") 8.4 (0.33") PIN 1 PIN 7 PIN 14 PIN 8
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PageLSD1001/25-XX PART NO. 3 ,6 ,14 11310872119 DPGFEDCBA NO PIN:4,5,12 ABCDEFGDP 9112781013 LSD10025-XX 3 ,6 ,14 LSD10015-XX
PIN NO. LSD10015-XX PIN NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Common Cathode NO PIN Anode E Common Anode NO PIN Cathode E LSD1001/25-XX PART NO. Anode F Cathode F Common Cathode Common Anode 1414 Anode G1111 Cathode G NO PIN1212 NO PIN Anode B1313 Cathode B Common Cathode Common Anode
Reverse Current Per Any Chip Ir 10 μA Operating Temperature Storage Temperature LSD10015-XX LSD10025-XX PART NO Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Cathode -25 ~ +85 -25 ~ +85 Material GaAlAs Red Emitted CHIP △λ (nm) λP (nm) common cathode or anode 66020 Tstg Topr Max. 4.83.03.6 Min. Typ. 4.07.2 Min. Typ. Electrical Vf(v)Iv(mcd) IV-M 2:1 Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter PD IFP IF Symbol UNIT mA mA mW100 100 SR Page 4/7 Common Anode LSD1001/25-XX PART NO.
Vr=5VIr IV-M Luminous Intensity Matching Ratio Symbol Test Condition For Each Parameter Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip mcdIv λP nm μA nm Unit Vfvolt If=10mA If=20mA If=20mA Test Condition If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page5/7LSD1001/25-XX PART NO.
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 6/7LSD1001/25-XX PART NO.
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles Solder Resistance Test High Temperature High Humidity Test Thermal Shock Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of hogh temperature for hours. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reliability Test: 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test ItemTest Condition JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference StandardDescription 7/7PageLSD1001/25-XX PART NO.