LSBKSUG2662-R1 LIGITEK | Alldatasheet
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts LSBKSUG2662/R1 DATA SHEET Pb BIPOLAR TYPE LED LAMPS LSBKSUG2662/R1-0908 - 200921 -Oct. DOC. NO : QW0905- REV. : A DATE : 發行 DCC 立碁電子
100%75% 50% -60° -30° 100%25%025%75% 50% 60° 30° 1/8Page SBKS Green PART NO. Package Dimensions LSBKSUG2662/R1 2.9 1.5MAX 3.3 □0.5 TYP 2.54TYP 1 2 Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 25.0MIN 3.1 1.0MIN 4.3
℃Topr Operating Temperature -20 ~ +80 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. GaAsP/GaP GaP LSBKSUG2662/R1 Green White Diffused Blue 574201.7 2.6 26475---4.2 10016028 10035065 Typical Electrical & Optical Characteristics (Ta=25 ℃) MATERIALPART NO Emitted Lens COLOR Min. Luminous intensity @ mA(mcd) Spectral halfwidth △λnm Peak wave length λPnm Min. Max. Forward voltage @20mA(V) Viewing angle 2θ 1/2 (deg) Max. Storage Temperature Tstg -30 ~ +100 ℃ 2/8Page mA2530IF Forward Current Reverse Current @5V Ir Peak Forward Current Duty 1/10@10KHz Power Dissipation PD IFP 5010 μA 12065 10075 mW mA Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol GreenSBKS Ratings UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSBKSUG2662/R1PART NO. Electrostatic Discharge( * ) ESD 500 2000 V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typ. 3.5 ---
PART NO. LSBKSUG2662/R1 Page3/8 Brightness Code For Standard LED Lamps LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SBKS CHIP Color Code SBKS CHIP Max.Min. 468465 462465 Group Dominant Wave length(nm) at20 mA 471 474 468 471 477474 Luminous Intensity(mcd) at 20 mA 9065 120 160 120 A16 A17 A18 Max.Min. Group 220160 350300 220300 A19 A21 A20
Max. 572 570 Min. 568 Dominant Wave length(nm) at20 mA Group 574 576 578 Luminous Intensity(mcd) at 20 mA PART NO. LSBKSUG2662/R1 13 120 160 120 906511 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UG CHIP Brightness Code For Standard LED Lamps Page4/8 UG CHIP Color Code Min. Max. Group
Forward Voltage(V) Relative Intensity@20mA Forward Current@20mA Ambient Temperature(℃) 02550 580 380 480 480 430 530 630 680 Wavelength (nm) 75100 0.5 Fig.3 Forward Current vs. Temperature 40 1.0 Fig.4 Relative Intensity vs. Wavelength LSBKSUG2662/R1PART NO.5/8 Page 1.5 Forward Current(mA) 123 0.5 Relative Intensity Normalize @20mA Forward Current(mA) 45 50 0.25 201525 30 1.0 0.75 1.25 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage SBKS CHIP Fig.2 Relative Intensity vs. Forward Current LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
Relative Intensity @20mA Wavelength (nm) 550500 650600 0.5 Relative Intensity @20mA Normalize @25℃ Forward Voltage@20mA Normaliz @25℃ Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength 1.0 Ambient Temperature(℃) 0.8 -40-2020 04060100 80-20 -40 200406080100 Fig.4 Relative Intensity vs. Temperature 1.1 0.9 1.0 0.5 1.0 1.5 2.0 Fig.3 Forward Voltage vs. Temperature 1.2 2.5 3.0 2.0 Forward Current(mA) Relative Intensity Normalize @20mA 3.0 Forward Voltage(V) 0.1 1.0 1.0 0.5 1.5 Forward Current(mA) 100101000 Fig.2 Relative Intensity vs. Forward Current 1000 100 3.0 2.5 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve UG CHIP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LSBKSUG2662/R1 Page6/8
PART NO. LSBKSUG2662/R1 Temp(°C) 25° 00° 120° 260° 2°/sec max Preheat 50 5°/sec max 100 260°C3sec Max 150 Time(sec) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Page 7/8
60 Seconds Max
Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
PART NO. LSBKSUG2662/R1 8/8Page
Description
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test ConditionTest Item 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Low Temperature Storage Test High Temperature Storage Test Operating Life Test Thermal Shock Test High Temperature High Humidity Test Reliability Test: This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2