LSBK3333-H0

LSBK3333-H0 LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS DATA SHEET LSBK3333/H0 Lead-Free Parts Pb DOC. NO : QW0905- REV. : DATE : 17 - Aug. - 2007 A LSBK3333/H0

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.5 MAX 7.6 8.6 5.0 5.9 PART NO. □0.5 TYP 2.54TYP 1.0MIN Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 25.0MIN + - 30°-30° 25%75%100%50% -60° 50%25%0 75%100% 60°

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mA μA mW IF Parameter Symbol Ir PD IFP 120 100 SBK Ratings Absolute Maximum Ratings at Ta=25 ℃ Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Forward Current Power Dissipation V ESD Topr Tstg -20 ~ +80 -30 ~ +100 500 Dominant Typical Electrical & Optical Characteristics (Ta=25 ℃) Operating Temperature Electrostatic Discharge( * ) Storage Temperature 550384.23.5 350 Typ. Min.Max. Typ. P 26470 Lens MATERIAL Blue InGaN/SiC Emitted Water Clear Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LSBK3333/H0 PART NO Forward voltage @20mA(V) COLOR wave length λ nm Spectral halfwidth △λnm Viewing angle 2θ 1/2 (deg) Luminous intensity @ mA(mcd) wave length λ nm 468 Peak D Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LSBK3333/H0PART NO.

Fig.3 Forward Current vs. Temperature Fig.4 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Current@20mA Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SBK CHIP 5801007550250 0.25 0.5 0.75 1.0 1.25 1.5 2010 15 25 30 380 0.5 480 480 430 530 630 680 1.0 13 245 Page 3/5LSBK3333/H0PART NO.

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 120° 25° Time(sec) 50 100Preheat0

60 Seconds Max

2°/sec max 150 260° Temp(°C) 5°/sec max 260°C3sec Max Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5 Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LSBK3333/H0PART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DescriptionTest ConditionTest Item The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Operating Life Test High Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard Page 5/5 Reliability Test: The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Thermal Shock Test Solder Resistance Test (10min) (10min) 2.total 10 cycles This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202:103B JIS C 7021: B-11 LSBK3333/H0PART NO.