LSBI3833-L32

LSBI3833-L32 LIGITEK | Alldatasheet

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Technical content

DOC. NO : QW0905- REV. : DATE : - 200828 - Apr. A LSBI3833/L32 LSBI3833/L32 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts

Page 1/5LSBI3833/L32PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.54TYP + - 5.6 25.0MIN 1.0MIN 8.7 5.0 1.5MAX □0.5 TYP 7.7 60° -60° 100% 30°-30°

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only mA mW mA μA V 120 IF PD IFP 500 Ir Topr ESD -20 ~ +80 ℃Tstg -30 ~ +100 Viewing angle 2θ 1/2 (deg) Luminous intensity @20mA(mcd) 550300 Typ.Min. Dominant wave length λDnm Spectral halfwidth △λnm 3.865465 Typ. Max. 4.7 Forward voltage @20mA(V) Parameter Peak Forward Current Duty 1/10@10KHz Forward Current Reverse Current @5V Electrostatic Discharge( * ) Power Dissipation Operating Temperature Storage Temperature MATERIAL Blue InGaN/SiC Emitted LSBI3833/L32 PART NO COLOR Lens Symbol Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) Water Clear Peak wave length λPnm 430 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. PART NO. LSBI3833/L32

Fig.5 Forward Current vs. Ambient Temperature Fig.3 Relative Intensity vs. Forward Current Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve Forward Current (mA DC) Ambient Temperature (℃) 502575 Relative Intensity(%) 0 5 25 Forward Current (mA DC) 1510 2035 30 40 125 100 Forward Current(mA DC) Forward Voltage(V) 2 3 4 SBI CHIP Relative Intensity Lead Temperature (℃) 0 25 50 75 100 Fig.4 Relative Intensity vs. Lead Temperature 3/5Page Relative Intensity(%) 480 Wavelength (nm) 380 430 0.5 630530 580 680 Fig.2 Relative Intensity vs. Wavelength 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBI3833/L32

PART NO. LSBI3833/L32

60 Seconds Max

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5

0 Preheat

25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

PART NO. LSBI3833/L32 Page 5/5

Description

This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Condition 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 Reliability Test: High Temperature Storage Test Operating Life Test Test Item Low Temperature Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 High Temperature High Humidity Test Solderability Test Solder Resistance Test Thermal Shock Test