LSBI2040 LIGITEK | Alldatasheet
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A - 200528 - Feb LSBI2040 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSBI2040 ROUND TYPE LED LAMPS DATA SHEET DOC. NO : QW0905- REV. : DATE :
25.0MIN 1.0MIN □0.5 TYP 2.54TYP 4.2 1.5MAX 5.2 4.03.0 °30 °60 %750 %25 % 50 % 100 °-30 °-60 %25%75 % 50%100 1/4PageLSBI2040PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation
@20mA(mcd) Typ. Spectral halfwidth △λnm 465 Dominant wave length λDnm 4.7 Max. Forward voltage @ mA(V) 3.8 Typ. Min. Viewing angle 2θ 1/2 (deg) 2/4Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mA μA V mW SBI Ratings 500 Ir -20 ~ +80 Max 260℃ for 5 sec Max (2mm from body) -30 ~ +100 120 PART NO. LSBI2040 Forward Current Peak Forward Current Duty 1/10@10KHz Parameter Operating Temperature Soldering Temperature Storage Temperature Electrostatic Discharge Reverse Current @5V Power Dissipation Typical Electrical & Optical Characteristics (Ta=25 ℃) Symbol ESD Tsol Topr Tstg IF PD IFP Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Peak wave length λPnm 430
Fig.2 Relative Intensity vs. Wavelength Relative Intensity(%) Wavelength (nm) Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA DC) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SBI CHIP 580 680 0.5 430380 480 630530 30 1.0 13 24 5 Page 3/4 Lead Temperature (℃)Forward Current (mA DC) Fig.3 Relative Intensity vs. Forward Current Relative Intensity(%) Fig.4 Relative Intensity vs. Lead Temperature Relative Intensity Fig.5 Forward Current vs. Ambient Temperature Ambient Temperature (℃) Forward Current (mA DC) 100 125 0 5 10 15 20 25 30 35 40 45 0 25 50 75 100 0 25 50 75 100 PART NO. LSBI2040
PART NO. LSBI2040 Page 4/4 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest ConditionTest Item Reliability Test: 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. Low Temperature Storage Test High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, + 72hrs) Operating Life Test This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hous. This test intended to see soldering well performed or not.