LPG2040-PF

LPG2040-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : 14 - Apr. - 2009 A LPG2040-PF DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS LPG2040-PF Pb Lead-Free Parts 發行 DCC 立碁電子

25.0MIN Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.54TYP 1.0MIN + - □0.5 TYP PART NO. Package Dimensions 1/5PageLPG2040-PF 4.2 5.2 1.5MAX 4.03.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 100 -60 -30° 60° 30°

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ IFP PD IF Tstg Topr Symbol Typical Electrical & Optical Characteristics (Ta=25 ℃) Power Dissipation Reverse Current @5V Storage Temperature Operating Temperature Parameter Peak Forward Current Duty 1/10@10KHz Forward Current 100 -40 ~ +100 -40 ~ +85 Ir 10 Ratings PG 120 mW μA mA mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/5 Viewing angle 2θ 1/2 (deg) Min. 8.0 Min. 1.7 Forward voltage @ mA(V) Max. 2.6 Peak wave length λPnm 555 Spectral halfwidth △λnm Typ. Luminous intensity @10mA(mcd) Emitted Green PART NO LPG2040-PF MATERIAL GaP Lens COLOR Green Diffused LPG2040-PFPART NO. Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 PG CHIP Fig.6 Directive Radiation 4.0 Page3/5LPG2040-PFPART NO.

0 Preheat

25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5

60 Seconds Max

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LPG2040-PFPART NO.

MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Page 5/5 Test ItemTest Condition Reliability Test: High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Description

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Thermal Shock Test Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. LPG2040-PFPART NO.