LMD8811-2JHR-XX-PF

LMD8811-2JHR-XX-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LMD8811/2JHR-XX-PF LMD8811/2JHR-XX-PF 18 - Mar. DOC. NO : QW0905- REV. : B DATE : - 2009 DATA SHEET Pb Lead-Free Parts DOT MATRIX DIGIT LED DISPLAY (1.84Inch) 發行 DCC 立碁電子

PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions PART NO. LMD8811/2JHR-XX-PF Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ø 0.51 TYP 36.0 (1.42") 5.50±0.50 9.00(0.35") Ø 4.80(0.19") PIN 1 47.8(1.88") 6.0*7= 42.0(1.65") 47.8 (1.88") PIN 13 PIN 14PIN 26

3,6,9,12,13,16,19,22,25,26 NO CONNECT 15818521224 11 87654321COLUMN ROW PIN 3,6,9,12,13,16,19,22,25,26 NO CONNECT 147 81 0 51 7 32 0 ROW PIN 1 23 COLUMN 24 2 21 5 3 4 5 18 8 15 6 7 PageLMD8811/2JHR-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Internal Circuit Diagram PART NO. LMD8811JHR-XX-PF LMD8812JHR-XX-PF

26 NO CONNECT

3/9Page PART NO. Electrical Connection LMD8811/2JHR-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO. 141 PIN NO. NO CONNECT Cathode Column 2 NO CONNECT Cathode Column 4 LMD8811JHR-XX-PF Cathode Column 8 Cathode Column 6 Cathode Column 7 Cathode Column 5 Cathode Column Cathode Column 3

PIN NO. 1 14 PIN NO. NO CONNECT NO CONNECT LMD8812JHR-XX-PF NO CONNECT NO CONNECT NO CONNECT

13 NO CONNECT

LMD8811/2JHR-XX-PF PART NO. Page4/9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Electrical Connection

LMD8811/2JHR-XX-PF PART NO. 5/9 2:1 IV-M HR 100 100 Ratings Symbol PD IFP IF Parameter Power Dissipation Forward Current Peak Forward Current Duty 1/10@10KHz Absolute Maximum Ratings at Ta=25 ℃ -25 ~ +85 -25 ~ +85 Iv(mcd)Vf(v) Electrical Topr Ir Tstg Reverse Current @5V Storage Temperature Operating Temperature CHIP Min. Typ. 2615.251.8 Typ. 2.4 Max. 1.82.415.2526 201.5 Min. 660 201.5660 Emitted Red RedGaAlAs GaAlAs Material Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Anode Common Cathode (nm) common cathode or anode PART NO λP (nm) Part Selection And Application Information(Ratings at 25)℃ LMD8811JHR-XX-PF LMD8812JHR-XX-PF mW μA mA mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page UNIT

LMD8811/2JHR-XX-PF PART NO. Page6/9 volt Unit mcd nm nm If=20mA If=10mA Test Condition If=20mA If=20mA Vf Symbol λP Iv Forward Voltage Per Chip Luminous Intensity Per Chip Test Condition For Each Parameter Parameter Spectral Line Half-Width Peak Wavelength LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only μA Vr=5VIr IV-M Reverse Current Any Chip Luminous Intensity Matching Ratio

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity@20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.5 -40-20-020 600650 2.03.04.05.0 4060 0.8 -0-20-404060 20 0.5 0.9 1.0 1.1 1.2 1.0 1.5 2.0 650700750 0.5 1.0 1.0 1.5 2.0 2.5 3.0 10080100 80 2.5 3.0 HR CHIP Page7/9 LMD8811/2JHR-XX-PF PART NO.

LMD8811/2JHR-XX-PF PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/9 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 260°C3sec Max 5°/sec max Time(sec) 15010050 260° Temp(°C) Preheat0 120° 25°

60 Seconds Max

2°/sec max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C

LMD8811/2JHR-XX-PF PART NO. Page Reference StandardDescription MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Test ConditionTest Item 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Reliability Test: High Temperature Storage Test Low Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test Operating Life Test Solderability Test Solder Resistance Test