LMD8801-2BG-XX LIGITEK | Alldatasheet
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DOC. NO : QW0905- REV. : B DATE : - 200921 - Apr. DATA SHEET LMD8801/2BG-XX/RP33-PF LMD8801/2BG-XX/RP33-PF DOT MATRIX DIGIT LED DISPLAY (0.787Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb 發行 DCC 立碁電子
2.5X7 =17.5 (0.689") 15.0 (0.591") (0.787") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.5X7=17.5 (0.689") PIN NO.1 2.5X7=17.5 (0.689") LMD8801/2BG-XX/RP33-PF LIGITEK Ø 0.51 TYP 3.3±0.5 ψ1.9(0.074") 5.9(0.232") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only (0.787") Package Dimensions LMD8801/2BG-XX/RP33-PF PART NO. 1/8Page PIN 1 PIN 8 PIN 16 PIN 9
PART NO. 2/8Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only COLUMN ROW PIN COLUMN ROW 6PIN 13 2 3
Cathode Row 2 Anode Row 2 14 Cathode Column 8 Cathode Column 7 Anode Column 8 Anode Column 7 Cathode Column 4 10 Cathode Column 1 Cathode Column 6 Anode Row 412 Cathode Column 5 Anode Row 3 Anode Row 1 Anode Row 6 Anode Column 4 Anode Column 1 Anode Column 6 Cathode Row 4 Anode Column 5 Cathode Row 1 Cathode Row 3 Cathode Row 6 PART NO. PIN NO. Electrical Connection PIN NO. Cathode Column 3 Cathode Column 2 Anode Row 8 Anode Row 7 LMD8801BG-XX/RP33-PF LMD8801/2BG-XX/RP33-PF Anode Row 51 Cathode Row 8 Anode Column 3 Anode Column 2 Cathode Row 7 Cathode Row 5 LMD8802BG-XX/RP33-PF Page3/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page UNIT Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ LMD8801BG-XX/RP33-PF PART NO λP (nm) CHIP common cathode or anodeEmitted GaP Green Material Common Anode Common Cathode 565 Electrical 2.1 Vf(v) Typ. 301.7 (nm) Min. 1.752.63.05 Min.Max. Typ. Iv(mcd) Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Forward Current Per Chip Power Dissipation Per Chip Operating Temperature Storage Temperature Reverse Current Per Any Chip Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol Tstg Topr Ir PD IFP IF -25 ~ +85 -25 ~ +85 100 120 G Ratings 2:1 IV-M 4/8 PART NO. LMD8802BG-XX/RP33-PF LMD8801/2BG-XX/RP33-PF
Luminous Intensity Matching Ratio Luminous Intensity Per Chip Test Condition For Each Parameter Parameter Reverse Current Any Chip Spectral Line Half-Width Peak Wavelength Forward Voltage Per Chip Symbol UnitTest Condition IV-M Ir μA Iv λP Vf mcd nm nm volt Vr=5V If=20mA If=10mA If=20mA If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page5/8 PART NO.LMD8801/2BG-XX/RP33-PF
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP 6/8 PART NO. LMD8801/2BG-XX/RP33-PF
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C 150 Time(sec) 5°/sec max 260°C3sec Max 10050Preheat 2°/sec max Temp(°C) 120° 260° 00° 25° Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
60 Seconds Max
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C PART NO. LMD8801/2BG-XX/RP33-PF
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Test Item Operating Life Test High Temperature High Humidity Test High Temperature Storage Test Low Temperature Storage Test Test Condition 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Thermal Shock Test Solder Resistance Test Solderability Test (10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 PART NO.LMD8801/2BG-XX/RP33-PF