LIR13733-PF

LIR13733-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. A DATE : - 200710 - May LIR13733-PF DATA SHEET INFRARED EMITTING DIODES LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LIR13733-PF Lead-Free Parts Pb

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LENS COLOR T-1 3/4 package individually The LIR13733-PF series are high power solution grown efficiency Gallium Arsenide 2. Suitable for pulsed applications. 3. Low average degradation. LIR13733-PF PART NO Device Selection Guide: infrared emitting diodes encapsulated in water clear plastic Descriptions: AlGaAs/GaAs MATERIAL NOTE:1.All dimension are in millimeters tolerance is ±0.25 unless otherwise noted 2.Specifications are subject to change without notice Features: 1. High radiant intensity. Package Dimensions PART NO. LIR13733-PF Page1/7 5.95.0 1.5MAX 7.6 8.6 2.54TYP 25.0MIN □0.5 TYP 1.0MIN

IF=20mA6.0 mW/sr3.0Le Radiant Intensity Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. Forward Voltage (@ 40 ms) Reverse Current Viewing Angle Aperture Radiant Incidence Peak Emission Wavelength Spectral Line Half Width mW/cm

1.21.6 VVF

462θ1/2 IR deg 100 μA 940 0.86 λpeak Ee 0.43 nm 50 nm IF=20mA VR=5V IF=20mA IF=20mA IF=20mA Electrical Optical Characteristics (Aa=25) ℃ Absolute Maximum Ratings at Ta=25 ℃ PARAMETER Electrostatic Discharge Operating Temperature Storage Temperature Peak Forward Current (300PPS,10μs Pulse) Forward Current Reverse Voltage Power Dissipation Parameter UNITTyp.SYMBOL Min. Max. Tstg ESD Topr -40 ~ +85 2000 -40 ~ +85 TEST CONDITION V Vr PD IF IFP 100 Symbol Ratings IR V mW mA A UNIT Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LIR13733-PF PART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Electro-Optical Characteristics Curve 3.0 10.0 1.0 Fig.6 Relative Radiant Power vs. Temperature 0.1 Fig.4 Relative Radiant Power Relative Radiant Power Normalize @ 20mA, 25℃ Forward DC Voltage Normalize @20mA, 25 ℃ Fig.5 Forward DC Voltage vs. Temperature Fig.3 Relative Radiant Power vs. Forward DC Current Relative Radiant Power Normalize @20mA 1.2 0.1 1.0 10.0 Relative Radiant Power Normalize @100 mA IFDC[mA] 10100 1000100 IFPK[mA] vs. Forward Peak Current 1.0 0.0 0.5 Fig.2 Relative Radiant Power vs. WavelengthFig.1 Forward Current vs. Forward Voltage Forward Voltage[V] 100 Forward Current[mA] 0.0 0.1 1.0 IR CHIP 1000 Relative Radiant Power Normalize @20mA 1.52.02.5 Wavelength[nm] 800850 900 950 100010501100 1.1 1.0 0.9 0.8 -40-20020406080100 60-40-200204080100 2.5 2.0 1.5 1.0 0.5 0.0 Ambient Temperature(°C)Ambient Temperature( °C) Page3/7LIR13733-PF PART NO.

(A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Drive Method: LED is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. Storage time: 1.The operation of Temperatures and RH are : 5℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5℃ ~ 35℃,RH<60%, they should be treated at 60℃±5 ℃fo r 15hrs. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. Circuit model A LED Page 4/7 Circuit model B LED LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LIR13733-PF PART NO.

15° 45° Anode side(cathode side on GaAlAs chips) Page 5/7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2. The LED lamps are designed for high-density mount- ing and have a structure which can alleviate mechan- ical stress due to clinching . Nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . Mounting: 1. If the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. For this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead. (O) (O) (X) LIR13733-PF PART NO.

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2°/sec max25° 0° 0 Preheat Temp(°C) 260° 120° 50 100 5°/sec max 260°C3sec Max Time(sec) 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7 Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

LIR13733-PF PART NO.

Reliability Test: Thermal Shock Test Solderability Test Solder Resistance Test High Temperature High Humidity Test Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test Item MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 7/7Page The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.

Description

The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=85 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LIR13733-PF PART NO.