LI5131-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only RECTANGLE TYPE LED LAMPS DATA SHEET DOC. NO : QW0905-LI5131-PF REV. : A DATE : 19 - May. - 2010 LI5131-PF 發行 DCC 立碁電子

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only + - 25.0MIN 2.54TYP 1.0MIN □0.5 TYP 1.5 MAX LI5131-PFPART NO. 1/5Page 7.0 0.7 2.8 2.0 5.0

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Viewing angle 2θ 1/2 (deg) -40 ~ +100Tstg Storage Temperature MATERIAL Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. PART NO LI5131-PFGaAsP/GaP Forward voltage @ mA(V) Luminous intensity @10mA(mcd) Peak wave length λPnm Spectral halfwidth △λnm Red Transparent LensEmitted Orange 635 1.7 Min. 45 2.6 Max. Typ. 4.5 Min. COLOR Absolute Maximum Ratings at Ta=25 ℃ Operating Temperature Power Dissipation Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Parameter Forward Current IF PD IFP Topr Ir Symbol mA30 -40 ~ +85 100 120 μA mA mW I Ratings UNIT 2/5 PART NO. LI5131-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 E - I CHIP Page3/5 PART NO. LI5131-PF

PART NO. LI5131-PF Page 4/5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 260°C3sec Max 5°/sec max 150 Time(sec) 100 260° Temp(°C) 50Preheat 2°/sec max 120° 00° 25°

60 Seconds Max

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 PART NO. LI5131-PF Reliability Test: Test Item Operating Life Test Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Low Temperature Storage Test 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Test Thermal Shock Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Solder Resistance Test Solderability Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles

Description

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2