LI2641-1-PF-TRS-X

LI2641-1-PF-TRS-X LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts LI2641-1-PF/TRS-X TAPE AND REEL TYPE LED LAMPS DATA SHEET LI2641-1-PF/TRS-X A - 200729 - Aug. DOC. NO : QW0905- REV. : DATE :

3.12.9 1.5MAX 4.33.3 2.54TYP 1.0MIN 25.0MIN □0.5 TYP + - Page1/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Package Dimensions LI2641-1-PF/TRS-X LI2641-1-PF Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. W1 W3 W0L P T F D ΔH - +

Absolute Maximum Ratings at Ta=25 ℃ Emitted Typical Electrical & Optical Characteristics (Ta=25 ℃) MATERIALPART NO LI2641-1-PF/TRS-X GaAsP/GaP Orange Reverse Current @5V Storage Temperature Operating Temperature Power Dissipation Peak Forward Current Duty 1/10@10KHz Forward Current Parameter Viewing angle 2θ 1/2 (deg) Luminous intensity @10mA(mcd) Peak wave length λPnm Spectral halfwidth △λnm Forward voltage @20mA(V) Red Transparent 45635 Lens 2.61.720 12 Min.Min. Max. Typ. COLOR μA10Ir -40 ~ +85 -40 ~ +100Tstg Topr PD IFP 100 mW 120 mA Page 2/6 Ratings IF Symbol I 30 mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LI2641-1-PF/TRS-XPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MaximumMinimumSYMBOL SPECIFICATIONS 4.20.17 18.5 2.00.08 0.73 3.00.12 0.15D3.8 0.69 17.5 F2.30.09 inchmmmm inch 28.5 26.51.04 1.12 20.90.82 23.50.93 1.08 1.025.5 27.5 0.7819.9 22.50.89 25.5 20.00.79 1.0 220.87 19.40.76 0.96 0.7519.0 24.5 210.83 18.40.72 0.9424.0H1 25.00.98 0.8521.5 22.5 0.89 19.0 27.51.08 0.75 11.00.43 361.42 0.71 1.0426.5 18.0 W0L 5.80.23 1.420.06 7.70.3 0.17P14.4 P25.10.2 0.49P12.4 13.00.51 15.50.61 19.00.75 4.00.16 0.57W114.5 0.69W317.5 W200 Package Dimensions• 0.33W08.59.750.38 D1D2 D3inchmm 4.02102 MARKING14.96380 T1 T2 1.538.1 1.9750.0 2.2557.2 3.4688.0 D maxmum 0.8521.50.8120.5 OPTION CODESYMBOL ITEMS Dimensions Symbol Information• TRS-1 Front-To-Rear Deflection Component Lead Pitch Tape Feed Hole Diameter TRS-4 TRS-3 TRS-6 TRS-5 TRS-8 TRS-9 TRS-11 TRS-10 TRS-7Feed Hole To Bottom Of Component TRS-2 TRS-13 TRS-14 Lead Length After Component Height Lead Location Center Of Component Location Overall Taped Package Thickness Tape Width Adhesive Tape Position Adhesive Tape Width Dimensions Symbol Information• REMARK:TRS=Tape And Reel Straight Leads inchmm 1.3734.9D1 3.08D78.2Reel Diameter Core Diameter Hub Recess Inside Diameter 0.5413.8D3 1.1830.0T1 Iside Reel Flange Thickness Overall Reel Thickness Arbor Hole Diameter 1.1328.6D2 Quantity/Reel 2000PCS Description minimumSymbol TRS-12 Specification LI2641-1-PF/TRS-XPART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 E - I CHIP Page4/6LI2641-1-PF/TRS-XPART NO. 30° 60° 100%75%50%25%025% -30° -60° 100%75%50% Fig.6 Directivity Radiation

2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 Temp(°C) 260°C3sec Max 5°/sec max 260° 25° 2°/sec max Preheat

60 Seconds Max

120° Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) LI2641-1-PF/TRS-XPART NO. Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest Condition Operating Life Test Reliability Test: Test Item 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Low Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Thermal Shock Test Solder Resistance Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test MIL-STD-202:103B JIS C 7021: B-11 LI2641-1-PF/TRS-XPART NO.