LI25030 LIGITEK | Alldatasheet

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21 - Apr. DOC. NO : QW0905- REV. : DATE : A - 2005 LI25030 LI25030 DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only RECTANGLE TYPE LED LAMPS

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation PART NO. Package Dimensions LI25030 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/4 1.0MIN. 3.18 LIGHTED AREA E 3.64 S 5.6 6.16 REFERENCE MARK 26.4MIN 0.38 0.5TYP 2.54TYP 6.65 − + 25%75%100% 50% -60° -30° 75%25%05 0 % 1 0 0 % 30° 60°

PART NO. Absolute Maximum Ratings at Ta=25 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) mA120IFP Peak Forward Current Duty 1/10@10KHz Max 260℃ for 5 sec Max (2mm from body) Max. Forward voltage @20mA(V)COLOR Red Diffused Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Emitted LI25030 GaAsP/GaP Orange MATERIALPART NO Min.Lens 635 45 1.7 2.6 Peak wave length λPnm Spectral halfwidth △λnm Soldering Temperature Reverse Current @5V Power Dissipation Operating Temperature Storage Temperature Tsol Tstg Topr PD Ir -40 ~ +85 -40 ~ +100 100 Min. Typ. 5.23.0 120 Viewing angle 2θ 1/2 (deg) Luminous intensity @10mA(mcd) mW μA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Symbol Forward Current Parameter IF I Ratings UNIT mA Page 2/4LI25030

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20-40 402008 0 1 0 0 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 PART NO. 700 750 E CHIP Page3/4LI25030

Description

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hous. This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. High Temperature High Humidity Test Solder Resistance Test Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, + 72hrs) Reliability Test: Operating Life Test Test Item PART NO. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard 4/4PageLI25030