LI2040-PF-TBS-X

LI2040-PF-TBS-X LIGITEK | Alldatasheet

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DOC. NO : QW0905-LI2040-PF/TBS-X REV. : A DATE : 25 -May. - 2009 DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LI2040-PF/TBS-X Pb Lead-Free Parts TAPE AND BOX TYPE LED LAMPS 發行 DCC 立碁電子

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LI2040-PF Page 1/6 Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only P T P1D W0L F ΔH W1 W3 - + PART NO. LI2040-PF/TBS-X 25.0MIN 1.0MIN □0.5 TYP 2.54TYP 4.2 1.5MAX 5.2 4.03.0

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Viewing angle 2θ 1/2 (deg) -40 ~ +100Tstg Storage Temperature MATERIAL Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. PART NO LI2040-PF/TBS-XGaAsP/GaP Forward voltage @ mA(V) Luminous intensity @10mA(mcd) Peak wave length λPnm Spectral halfwidth △λnm Red Diffused LensEmitted Orange 635 1.7 Min. 45 2.6 Max. Typ. Min. COLOR Absolute Maximum Ratings at Ta=25 ℃ Operating Temperature Power Dissipation Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Parameter Forward Current IF PD IFP Topr Ir Symbol mA30 -40 ~ +85 100 120 μA mA mW I Ratings UNIT 2/6PART NO. LI2040-PF/TBS-X

PART NO. LI2040-PF/TBS-X Page 3/6 1.025.50.96TBS-824.5 TBS-9 TBS-11 TBS-12 TBS-10 TBS-13 REMARK:TBS=Tape And Box Straight Leads Specification 2500PCS Dimensions Symbol Information•

Description

10.4W265 H501.97 Symbol L minimum 330 mm 13.0 inch Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Lead Length After Component Height Feed Hole To Overall Component Height Adhesive Tape Width Adhesive Tape Position Tape Width Feed Hole Location Package Dimensions• 10.8275 602.4 maxmum inch 13.4340 mm T 17.5 8.5 14.5 0.69 0.57 0.33 5.1 4.4 0.2 0.17 L 0.8120.5 18.0 0.71 18.4 21.0 19.0 0.72 0.83 0.75 0.5113 0.06 0.3 0.23 0.61 0.16 0.75 0.38 4.0 15.5 9.75 7.7 1.42 5.8 0.79 0.87 0.85 0.76 0.43 1.42 0.75 21.5 19.0 20.0 22.0 19.4 OPTION CODE TBS-2 TBS-1 TBS-5 TBS-6 TBS-3 TBS-7 Tape Feed Hole Diameter Front-To-Rear Deflection Feed Hole To Bottom Of Component Component Lead Pitch Dimension Symbol Information• SYMBOL ITEMS SPECIFICATIONS 1.025.5 19.9 24.0 22.5 0.78 0.94 0.89 17.5 21.5 0.69 0.85 SYMBOL Minimum 3.8 mm 0.15 inch 0.123.0 0.08 0.89 0.73 0.93 0.82 1.04 0.98 26.5 20.9 23.5 25.0 18.5 22.5 2.0 inch 0.17 Maximum mm 4.2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 E -I CHIP Page4/6PART NO. LI2040-PF/TBS-X Fig.6 Directivity Radiation 30°-30° 60° 50%75%100% -60° 50%25%0100%75%25%

PART NO. LI2040-PF/TBS-X Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Time(sec) 150 260°C3sec Max 100 5°/sec max 50Preheat 2°/sec max 260° 120° 0° 0 25° Temp(°C)

PART NO. LI2040-PF/TBS-X Page 6/6 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Condition 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 Reliability Test: High Temperature Storage Test Operating Life Test Test Item Low Temperature Storage Test The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 High Temperature High Humidity Test Solderability Test Solder Resistance Test Thermal Shock Test