LI12340 LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : 03 - May - 2005 DATA SHEET A LI12340 ROUND TYPE LED LAMPS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LI12340

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LI12340PART NO. Package Dimensions 1/4Page 25%75%100% 50% -60° -30° 07 5 %25% 50% 100% 30° 60° 25.0MIN 3.0 3.8 □0.5 TYP 1.0MIN2.54TYP 1.5MAX 3.3 4.1

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Viewing angle 2θ 1/2 (deg) -40 ~ +100Tstg Storage Temperature MATERIAL Typical Electrical & Optical Characteristics (Ta=25 ℃) Soldering Temperature Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. PART NO LI12340 GaAsP/GaP Forward voltage @ mA(V) Luminous intensity @10mA(mcd) Peak wave length λPnm Spectral halfwidth △λnm Red Diffused LensEmitted Orange 635 1.7 Min. 45 2.6 Max. 6.5 Typ. 4.5 Min. 112 COLOR Tsol Max 260℃ for 5 sec Max (2mm from body) Absolute Maximum Ratings at Ta=25 ℃ Operating Temperature Power Dissipation Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Parameter PART NO. Forward Current IF PD IFP Topr Ir Symbol mA30 -40 ~ +85 100 120 μA mA mW I Ratings UNIT 2/4LI12340

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20-40 402008 0 1 0 0 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 PART NO. 700 750 E CHIP Page3/4LI12340

MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hous. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs Reliability Test: Test Item High Temperature Storage Test Low Temperature Storage Test Operating Life Test PART NO. Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) Test Condition Description 4/4PageLI12340