LI1030 LIGITEK | Alldatasheet
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LI1030 TOWER TYPE LED LAMPS DATA SHEET DOC. NO : QW0905-LI1030 REV. : A DATE : 05 - Jul - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 4.8 Package Dimensions 2.0 2.5 3.5 1.5MAX 8.0 4.5 PART NO. LI1030 2.54TYP 1.0MIN 30° -30° Directivity Radiation 50% 100%75%25% 0 25%100% 75% 50% -60° 60° Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. □0.5 TYP 25.0MIN
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LI1030 UNIT Ratings I SymbolParameter Absolute Maximum Ratings at Ta=25 ℃ mW mA120 100 μA -40 ~ +85 IFP PD Peak Forward Current Duty 1/10@10KHz Power Dissipation Ir Topr Operating Temperature Reverse Current @5V mA30IF Forward Current Max 260℃ for 5 sec Max (2mm from body)Tsol Soldering Temperature Luminous intensity @10mA(mcd) Forward voltage @20mA(V) Spectral halfwidth △λnm COLOR PART NO MATERIAL Typical Electrical & Optical Characteristics (Ta=25 ℃) Min. Typ. 10 604.5 Max.Min. 2.645 1.7635 LensEmitted Orange Red Diffused GaAsP/GaP LI1030 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Peak wave length λPnm Viewing angle 2θ 1/2 (deg) Storage Temperature Tstg -40 ~ +100 ℃
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20-40 402008 0 1 0 0 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700 750 Page3/4 PART NO. LI1030
MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 PART NO. LI1030 DescriptionTest ConditionTest Item Operating Life Test Reliability Test: 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature Storage Test Low Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, + 72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this test is the resistance of the device under tropical for hous. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles High Temperature High Humidity Test Solder Resistance Test Thermal Shock Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not.Solderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs