LHY3333R-S46-PF

LHY3333R-S46-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905-LHY 3333R/S46-PF-A01 REV. : B DATE : 05 - Nov. - 2009 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LHY3333R/S46-PF DATA SHEET SUPER BRIGHT ROUND TYPE LED LAMPS 發行 DCC 立碁電子

25.0MIN 1.5MAX Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 1.0MIN 2.54TYP + - 0.5 TYP 8.67.6 5.0 5.9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions PART NO. LHY3333R/S46-PF Page 1/5 60° 100%75%100% 25% 50% 50%0 25% 75% -60° -30° 30°

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNITSymbol Ratings Page 2/5 mA mA V μA mW IF IFP ESD Ir PD 2000 Topr Tstg -40 ~ +85 -40 ~ +100 Parameter Forward Current Peak Forward Current Duty 1/10@10KHz Electrostatic Discharge( * ) Reverse Current @5V Power Dissipation Operating Temperature Storage Temperature Absolute Maximum Ratings at Ta=25 ℃ Static Electricity or power surge will damage the LED. Use of a c onductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) Dominant wave length λDnm Luminous intensity @20mA(mcd) Viewing angle 2θ 1/2 (deg) Forward voltage @20mA(V) Spectral halfwidth △λnmPART NO MATERIAL AlGaInP Yellow Water Clear Emitted Lens Max. 2.61.720 Min. 303400 5000 Min. Typ. COLOR Min. Max. 592585 PART NO. LHY3333R/S46-PF LHY3333R/S46-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 500 550 600 0.0 0.5 1.0 650 Typical Electro-Optical Characteristics Curve HYR CHIP Page3/5 PART NO. LHY3333R/S46-PF

60 Seconds Max

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile 150 260°C3sec Max 5°/sec max 260° 120° 100 2°/sec max 25° 00° Preheat Time(sec) Temp(°C) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. PART NO. LHY3333R/S46-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference StandardDescription This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to see soldering well performed or not. Test Item Operating Life Test Reliability Test: High Temperature Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Low Temperature Storage Test Thermal Shock Test Solder Resistance Test Solderability Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec (10min) (10min) 2.total 10 cycles 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition PART NO. LHY3333R/S46-PF